董事介绍
注：董事持股数取自最新公司公告
| 姓名 | 性别 | 职位 | 年龄 | 薪酬 | 持股数(万股) | 截止日期 |
|---|---|---|---|---|---|---|
| David J. Wolenski | 男 | Director | 61 | 2.00万美元 | 未持股 | 2023-05-08 |
| Joy C. Hou | 女 | Director | 47 | 2.00万美元 | 未持股 | 2023-05-08 |
| Maria N. Fregosi | 女 | Director | 57 | 1.88万美元 | 未持股 | 2023-05-08 |
| Steven N. Bronson | 男 | Chairman of the Board, Chief Executive Officer and President | 57 | 35.17万美元 | 未持股 | 2023-05-08 |
高管介绍
注：高管持股数取自最新公司公告
| 姓名 | 性别 | 职位 | 年龄 | 薪酬 | 持股数(万股) | 截止日期 |
|---|---|---|---|---|---|---|
| Gene Chen | 男 | Vice President of Engineering and Advanced Materials | 51 | 16.52万美元 | 未持股 | 2023-05-08 |
| Ryan J. Hoffman | 男 | Chief Financial Officer and Secretary | 44 | 11.78万美元 | 未持股 | 2023-05-08 |
| Steven N. Bronson | 男 | Chairman of the Board, Chief Executive Officer and President | 57 | 35.17万美元 | 未持股 | 2023-05-08 |
董事简历
中英对照 | 中文 | 英文- David J. Wolenski
-
David J. Wolenski,2020年6月加入互联电子公司董事会。他目前担任Electro-Mechanical Products，Inc.的总裁和董事会成员。Electro-Mechanical Products，Inc.是一家私营公司，为半导体、激光和医疗设备行业制造精密加工部件和热管理系统。从1996年到2000年，沃伦斯基先生是OZO Automation，Inc.（OTCBB：OZOA）的首席执行官，该公司是一家上市公司，为电子行业生产机器人工作站。作为首席执行官，他还负责将OZO的资产出售给芬兰Olunsalo的JOT Automation，并在2000年至2001年期间担任其Depaneling子公司的总裁。1983至1996年，Wolenski先生在Johns Manville公司担任多个职位，该公司是玻璃纤维绝缘材料和工程产品的全球领导者，包括在制造、业务发展和质量保证方面的管理任务。Wolenski先生目前担任Qualstar Corporation（OTCMKTS：QBAK）董事会成员，自2013年起担任该职务。他过去的董事会成员包括OZO Automation，Inc.和Bio-Medical Automation，Inc.，他曾在1996至1999年担任董事，他曾在1999至2000年担任董事。Wolenski先生拥有科罗拉多大学博尔德分校机械工程学士学位（1983年）和科罗拉多大学丹佛分校MBA学位（1990年）。
David J. Wolenski,joined Interlink Electronics, Inc. Board in June 2020. He currently serves as President and on the Board of Directors of Electro-Mechanical Products, Inc., a privately held company engaged in the manufacture of precision-machined components and thermal management systems for the semiconductor, laser, and medical device industries. From 1996 to 2000, Mr. Wolenski was Chief Executive Officer of OZO Automation, Inc. (OTCBB: OZOA), a publicly traded company that produced robotic workstations for the electronics industry. As Chief Executive Officer, he also managed the sale of OZO's assets to JOT Automation of Olunsalo, Finland, and served as President of their Depaneling subsidiary from 2000 to 2001. From 1983 to 1996, Mr. Wolenski held various positions with Johns Manville Corporation, a worldwide leader in fiberglass insulations and engineered products, which included managerial assignments in manufacturing, business development, and quality assurance. Mr. Wolenski currently serves on the board of directors of Qualstar Corporation (OTCMKTS: QBAK), a position he has held since 2013. His past board affiliations have included OZO Automation, Inc., where he was a director from 1996 to 1999, and Bio-Medical Automation, Inc., where he was a director from 1999 to 2000. Mr. Wolenski holds a BS degree in Mechanical Engineering from the University of Colorado at Boulder (1983), and an MBA from the University of Colorado at Denver (1990). - David J. Wolenski,2020年6月加入互联电子公司董事会。他目前担任Electro-Mechanical Products，Inc.的总裁和董事会成员。Electro-Mechanical Products，Inc.是一家私营公司，为半导体、激光和医疗设备行业制造精密加工部件和热管理系统。从1996年到2000年，沃伦斯基先生是OZO Automation，Inc.（OTCBB：OZOA）的首席执行官，该公司是一家上市公司，为电子行业生产机器人工作站。作为首席执行官，他还负责将OZO的资产出售给芬兰Olunsalo的JOT Automation，并在2000年至2001年期间担任其Depaneling子公司的总裁。1983至1996年，Wolenski先生在Johns Manville公司担任多个职位，该公司是玻璃纤维绝缘材料和工程产品的全球领导者，包括在制造、业务发展和质量保证方面的管理任务。Wolenski先生目前担任Qualstar Corporation（OTCMKTS：QBAK）董事会成员，自2013年起担任该职务。他过去的董事会成员包括OZO Automation，Inc.和Bio-Medical Automation，Inc.，他曾在1996至1999年担任董事，他曾在1999至2000年担任董事。Wolenski先生拥有科罗拉多大学博尔德分校机械工程学士学位（1983年）和科罗拉多大学丹佛分校MBA学位（1990年）。
- David J. Wolenski,joined Interlink Electronics, Inc. Board in June 2020. He currently serves as President and on the Board of Directors of Electro-Mechanical Products, Inc., a privately held company engaged in the manufacture of precision-machined components and thermal management systems for the semiconductor, laser, and medical device industries. From 1996 to 2000, Mr. Wolenski was Chief Executive Officer of OZO Automation, Inc. (OTCBB: OZOA), a publicly traded company that produced robotic workstations for the electronics industry. As Chief Executive Officer, he also managed the sale of OZO's assets to JOT Automation of Olunsalo, Finland, and served as President of their Depaneling subsidiary from 2000 to 2001. From 1983 to 1996, Mr. Wolenski held various positions with Johns Manville Corporation, a worldwide leader in fiberglass insulations and engineered products, which included managerial assignments in manufacturing, business development, and quality assurance. Mr. Wolenski currently serves on the board of directors of Qualstar Corporation (OTCMKTS: QBAK), a position he has held since 2013. His past board affiliations have included OZO Automation, Inc., where he was a director from 1996 to 1999, and Bio-Medical Automation, Inc., where he was a director from 1999 to 2000. Mr. Wolenski holds a BS degree in Mechanical Engineering from the University of Colorado at Boulder (1983), and an MBA from the University of Colorado at Denver (1990).
- Joy C. Hou
-
Joy C. Hou,2020年6月加入互联电子公司董事会。侯女士目前担任Apex Group美洲实物资产产品开发主管，Apex Group是全球最大的金融机构解决方案提供商之一，管理和服务的资产达3T美元。此外，她还是MREN，Inc.的董事长和联合创始人。MREN，Inc.是一家自2013年起服务于商业房地产行业的企业技术平台。侯女士在金融、科技和管理领域拥有30多年的商业和创业经验。在加入MREN之前，侯女士是RAISC，Inc.的首席执行官和联合创始人。RAISC，Inc.是一个技术支持的银行不良资产平台，该平台集中了超过3B美元的商业房地产资产的数据，并支持超过1.5B美元的资产处置。此外，侯逸凡还在华尔街工作了10多年，在唐纳森、Lufkin & Jenrette和雷曼兄弟担任多个债务和股权投资职位，并在巴克莱银行资本担任酒店业务主管。侯女士目前是康奈尔亚洲校友会的董事会成员，担任大学关系副总裁，并曾在蒙特梭利乡村学校董事会任职。侯女士拥有康奈尔大学杰出酒店管理学院的理学学士学位。
Joy C. Hou,joined Interlink Electronics, Inc. Board in June 2020. Ms. Hou presently serves as the Head of Product Development for Real Assets in Americas at Apex Group, one of the largest solution providers for financial institutions with $3T of assets under administration and services globally. In addition, she is the Chairman and Co-Founder of MREN, Inc., an enterprise technology platform serving the commercial real estate industry since 2013. Ms. Hou has over 30 years of business and entrepreneurial experience in finance, technology, and management. Prior to MREN, Ms. Hou was the CEO and Co-Founder of RAISC, Inc., a tech-enabled bank distressed asset platform that centralized data for over $3B of commercial real estate assets and supported the disposition of over $1.5B of assets. In addition, Ms. Hou spent over 10 years on Wall Street where she held various debt and equity investment positions at Donaldson, Lufkin & Jenrette and Lehman Brothers and served as the Head of Hospitality Practice at Barclays Capital. Ms. Hou is currently on the Board of Cornell Asian Alumni Association as the Vice President of University Relations and previously served on the Board of Country Montessori School. Ms. Hou holds a Bachelor of Science degree from Cornell University's School of Hotel Administration with Distinction. - Joy C. Hou,2020年6月加入互联电子公司董事会。侯女士目前担任Apex Group美洲实物资产产品开发主管，Apex Group是全球最大的金融机构解决方案提供商之一，管理和服务的资产达3T美元。此外，她还是MREN，Inc.的董事长和联合创始人。MREN，Inc.是一家自2013年起服务于商业房地产行业的企业技术平台。侯女士在金融、科技和管理领域拥有30多年的商业和创业经验。在加入MREN之前，侯女士是RAISC，Inc.的首席执行官和联合创始人。RAISC，Inc.是一个技术支持的银行不良资产平台，该平台集中了超过3B美元的商业房地产资产的数据，并支持超过1.5B美元的资产处置。此外，侯逸凡还在华尔街工作了10多年，在唐纳森、Lufkin & Jenrette和雷曼兄弟担任多个债务和股权投资职位，并在巴克莱银行资本担任酒店业务主管。侯女士目前是康奈尔亚洲校友会的董事会成员，担任大学关系副总裁，并曾在蒙特梭利乡村学校董事会任职。侯女士拥有康奈尔大学杰出酒店管理学院的理学学士学位。
- Joy C. Hou,joined Interlink Electronics, Inc. Board in June 2020. Ms. Hou presently serves as the Head of Product Development for Real Assets in Americas at Apex Group, one of the largest solution providers for financial institutions with $3T of assets under administration and services globally. In addition, she is the Chairman and Co-Founder of MREN, Inc., an enterprise technology platform serving the commercial real estate industry since 2013. Ms. Hou has over 30 years of business and entrepreneurial experience in finance, technology, and management. Prior to MREN, Ms. Hou was the CEO and Co-Founder of RAISC, Inc., a tech-enabled bank distressed asset platform that centralized data for over $3B of commercial real estate assets and supported the disposition of over $1.5B of assets. In addition, Ms. Hou spent over 10 years on Wall Street where she held various debt and equity investment positions at Donaldson, Lufkin & Jenrette and Lehman Brothers and served as the Head of Hospitality Practice at Barclays Capital. Ms. Hou is currently on the Board of Cornell Asian Alumni Association as the Vice President of University Relations and previously served on the Board of Country Montessori School. Ms. Hou holds a Bachelor of Science degree from Cornell University's School of Hotel Administration with Distinction.
- Maria N. Fregosi
-
Maria N. Fregosi,2021年2月加入互联电子公司董事会。弗雷戈西女士曾于2020年至2022年担任Home Point Capital Inc.（纳斯达克股票代码：HMPT）的首席投资官，该公司是一家领先的住宅抵押贷款发起人和服务商，负责管理和监督该公司的投资。弗雷戈西女士是Home Point Capital的创始成员，曾于2018年至2020年担任其首席财务官，并于2015年至2018年担任其首席战略官和首席资本市场官。弗雷戈西女士自2020年起担任Home Point Mortgage Acceptance Corp.董事会成员。在加入Home Point Capital之前，弗雷戈西女士曾担任零售抵押贷款发起机构Hamilton Group Funding的首席资本市场官。此外，Fregosi女士还曾担任Catalyst Financial的首席运营官和首席合规官，这是一家提供全方位服务的价值型投资银行公司，同时也是BKFCapital Group公司的首席运营官。Fregosi女士还曾担任精品专业金融公司Client First Settlement Funding的首席运营官和首席财务官，以及荷兰银行的执行副总裁。Fregosi女士拥有罗切斯特大学西蒙学院的金融工商管理硕士学位，并以优异成绩毕业于SUNY布法罗州立学院的经济学学士学位。
Maria N. Fregosi,joined Interlink Electronics, Inc. Board in February 2021. Ms. Fregosi previously served as Chief Investment Officer of Home Point Capital Inc. (NASDAQ:HMPT) from 2020 to 2022, a leading residential mortgage originator and servicer, where she was responsible for managing and monitoring the company's investments. Ms. Fregosi is a founding member of Home Point Capital, and previously served as its Chief Financial Officer from 2018 to 2020 as well as its Chief Strategy Officer and Chief Capital Markets Officer from 2015 to 2018. Ms. Fregosi has served as a member of the Board of Home Point Mortgage Acceptance Corp. since 2020. Prior to joining Home Point Capital, Ms. Fregosi served as Chief Capital Markets Officer for Hamilton Group Funding, a retail mortgage loan originator. In addition, Ms. Fregosi previously served as the Chief Operating Officer and Chief Compliance Officer of Catalyst Financial, a full-service value-based investment banking firm, and simultaneously the Chief Operating Officer for BKF Capital Group, Inc. Ms. Fregosi also served as Chief Operating Officer and Chief Financial Officer of Client First Settlement Funding, a boutique specialty finance company, and as an Executive Vice President at ABN AMRO Bank. Ms. Fregosi holds a Master of Business Administration in Finance from the University of Rochester's Simon School and is a Summa Cum Laude graduate with a Bachelor of Arts in Economics from SUNY Buffalo State College. - Maria N. Fregosi,2021年2月加入互联电子公司董事会。弗雷戈西女士曾于2020年至2022年担任Home Point Capital Inc.（纳斯达克股票代码：HMPT）的首席投资官，该公司是一家领先的住宅抵押贷款发起人和服务商，负责管理和监督该公司的投资。弗雷戈西女士是Home Point Capital的创始成员，曾于2018年至2020年担任其首席财务官，并于2015年至2018年担任其首席战略官和首席资本市场官。弗雷戈西女士自2020年起担任Home Point Mortgage Acceptance Corp.董事会成员。在加入Home Point Capital之前，弗雷戈西女士曾担任零售抵押贷款发起机构Hamilton Group Funding的首席资本市场官。此外，Fregosi女士还曾担任Catalyst Financial的首席运营官和首席合规官，这是一家提供全方位服务的价值型投资银行公司，同时也是BKFCapital Group公司的首席运营官。Fregosi女士还曾担任精品专业金融公司Client First Settlement Funding的首席运营官和首席财务官，以及荷兰银行的执行副总裁。Fregosi女士拥有罗切斯特大学西蒙学院的金融工商管理硕士学位，并以优异成绩毕业于SUNY布法罗州立学院的经济学学士学位。
- Maria N. Fregosi,joined Interlink Electronics, Inc. Board in February 2021. Ms. Fregosi previously served as Chief Investment Officer of Home Point Capital Inc. (NASDAQ:HMPT) from 2020 to 2022, a leading residential mortgage originator and servicer, where she was responsible for managing and monitoring the company's investments. Ms. Fregosi is a founding member of Home Point Capital, and previously served as its Chief Financial Officer from 2018 to 2020 as well as its Chief Strategy Officer and Chief Capital Markets Officer from 2015 to 2018. Ms. Fregosi has served as a member of the Board of Home Point Mortgage Acceptance Corp. since 2020. Prior to joining Home Point Capital, Ms. Fregosi served as Chief Capital Markets Officer for Hamilton Group Funding, a retail mortgage loan originator. In addition, Ms. Fregosi previously served as the Chief Operating Officer and Chief Compliance Officer of Catalyst Financial, a full-service value-based investment banking firm, and simultaneously the Chief Operating Officer for BKF Capital Group, Inc. Ms. Fregosi also served as Chief Operating Officer and Chief Financial Officer of Client First Settlement Funding, a boutique specialty finance company, and as an Executive Vice President at ABN AMRO Bank. Ms. Fregosi holds a Master of Business Administration in Finance from the University of Rochester's Simon School and is a Summa Cum Laude graduate with a Bachelor of Arts in Economics from SUNY Buffalo State College.
- Steven N. Bronson
-
Steven N. Bronson，他于2013年7月3日被任命为首席执行官。他和他的BKF Capital Group公司拥有23.4的Qualstar股票。他一直担任BKF公司的主席兼首席执行官（2008年10月以来）。他于2010年7月成为Interlink Electronics公司（Force-Sensing Resistor（FSR）技术的全球领先设计专利和印刷电子产品的先驱）的主席兼首席执行官。自1996年以来，他一直担任Bronson & Co.（投资银行公司，建议私人和上市、新兴市场增长和中产公司）的董事长兼首席执行官。此外，他曾担任Mikron Infrared Instruments公司的主席兼首席执行官（从1998年8月到1999年5月他成功地重组和出售）。
Steven N. Bronson,has over 35 years of business and entrepreneurial experience. His successful background in investment banking, operations, and management has led him to acquire meaningful stakes in several promising technology companies and assume CEO roles. Mr. Bronson became the Chairman and CEO of Interlink Electronics in 2010 and took on the role of President less than a year later.In July 2013, Mr. Bronson assumed the positions of President and CEO of Qualstar Corporation (OTCMKTS: QBAK)—a high-quality tape library manufacturer—and its subsidiary N2Power, a manufacturer of high efficiency power supplies for diverse electronics industries. He immediately initiated a turnaround strategy, implementing cost-cutting measures and aggressive sales efforts. Since 2008, Mr. Bronson has held the position of Chairman, President, and CEO of BKF Capital Group, Inc. (OTCMKTS: BKFG) a publicly traded company operating through its wholly-owned subsidiaries, BKF Asset Holdings, Inc., which invests in publicly and privately owned businesses, and Bronson Financial LLC, a FINRA member investment banking firm (providing M&A advisory and capital raising services to lower and middle-market companies). In addition, Mr. Bronson served on the board of Mikron Infrared Instruments, Inc. from September 1996 to July 2000. During a restructuring period spanning August 1998 to May 1999, he was appointed Mikron's Chairman and CEO. Mr. Bronson led the effort of recruiting a top-notch management team, eventually increasing the company's revenue by 500 percent; it was sold in April 2007. Mr. Bronson has also served as the Chairman, President, and Chief Executive Officer of Ridgefield Acquisition Corp. (OTCMKTS: RDGA) since 1996. Ridgefield Acquisition Corp. is a public shell that is seeking a merger, acquisition, or business combination with a viable operating entity. Mr. Bronson currently holds the Series 4, 7, 24, 27, 53, 55, and 79 licenses. - Steven N. Bronson，他于2013年7月3日被任命为首席执行官。他和他的BKF Capital Group公司拥有23.4的Qualstar股票。他一直担任BKF公司的主席兼首席执行官（2008年10月以来）。他于2010年7月成为Interlink Electronics公司（Force-Sensing Resistor（FSR）技术的全球领先设计专利和印刷电子产品的先驱）的主席兼首席执行官。自1996年以来，他一直担任Bronson & Co.（投资银行公司，建议私人和上市、新兴市场增长和中产公司）的董事长兼首席执行官。此外，他曾担任Mikron Infrared Instruments公司的主席兼首席执行官（从1998年8月到1999年5月他成功地重组和出售）。
- Steven N. Bronson,has over 35 years of business and entrepreneurial experience. His successful background in investment banking, operations, and management has led him to acquire meaningful stakes in several promising technology companies and assume CEO roles. Mr. Bronson became the Chairman and CEO of Interlink Electronics in 2010 and took on the role of President less than a year later.In July 2013, Mr. Bronson assumed the positions of President and CEO of Qualstar Corporation (OTCMKTS: QBAK)—a high-quality tape library manufacturer—and its subsidiary N2Power, a manufacturer of high efficiency power supplies for diverse electronics industries. He immediately initiated a turnaround strategy, implementing cost-cutting measures and aggressive sales efforts. Since 2008, Mr. Bronson has held the position of Chairman, President, and CEO of BKF Capital Group, Inc. (OTCMKTS: BKFG) a publicly traded company operating through its wholly-owned subsidiaries, BKF Asset Holdings, Inc., which invests in publicly and privately owned businesses, and Bronson Financial LLC, a FINRA member investment banking firm (providing M&A advisory and capital raising services to lower and middle-market companies). In addition, Mr. Bronson served on the board of Mikron Infrared Instruments, Inc. from September 1996 to July 2000. During a restructuring period spanning August 1998 to May 1999, he was appointed Mikron's Chairman and CEO. Mr. Bronson led the effort of recruiting a top-notch management team, eventually increasing the company's revenue by 500 percent; it was sold in April 2007. Mr. Bronson has also served as the Chairman, President, and Chief Executive Officer of Ridgefield Acquisition Corp. (OTCMKTS: RDGA) since 1996. Ridgefield Acquisition Corp. is a public shell that is seeking a merger, acquisition, or business combination with a viable operating entity. Mr. Bronson currently holds the Series 4, 7, 24, 27, 53, 55, and 79 licenses.
高管简历
中英对照 | 中文 | 英文- Gene Chen
Gene Chen，2021年5月加入Interlink，担任互联电子公司工程与先进材料副总裁。陈博士在先进材料和电子设备领域拥有超过20年的经验，并在各种技术领域担任领导职务，包括力传感和人机界面（HMI）技术。在加入Interlink之前，他于2016年至2021年担任力传感器公司New Degree Technology的CTO，领导该公司的研发和产品开发团队。在此之前，他是Pixelligent Technologies，LLC的创始成员，并于2009年至2016年担任工程副总裁。他拥有多元化、跨学科的背景，还担任过管理纳米材料和先进材料项目的职务，这些材料的应用范围从LED和OLED到半导体，再到宇宙飞船的介质涂层。陈博士还曾在美国国家科学基金会和能源部的众多资助评审小组任职。陈博士在马里兰大学帕克分校获得电气工程哲学博士学位，主要研究电子物理和微电子学。作为科学界的活跃成员，他拥有14项专利，发表了17篇科学论文，并参加过多个同行评审团。陈博士领导Interlink位于加利福尼亚州卡马里洛的研发和材料科学实验室，并领导Interlink的全球工程团队。
Gene Chen,joined Interlink in May 2021 as Interlink Electronics, Inc. Vice President of Engineering & Advanced Materials. Dr. Chen has more than two decades of experience in advanced materials and electronic devices and has taken leadership roles in a wide variety of technical fields, including force sensing and human machine interface (HMI) technology. Prior to joining Interlink, from 2016 to 2021 he was CTO at force sensor company New Degree Technology, where he led its R&D and product development teams. Prior to that, he was the founding member of Pixelligent Technologies, LLC and served as VP of Engineering from 2009 to 2016. His diverse, interdisciplinary background has also included roles managing projects working on nanomaterials and advanced materials for applications ranging from LEDs and OLEDs to semiconductors to dielectric coatings for spaceships. Dr. Chen has also served on numerous grant review panels for the National Science Foundation and Department of Energy. Dr. Chen earned a doctorate of philosophy in electrical engineering – focusing on electro-physics and microelectronics – from the University of Maryland, College Park. An active member of the scientific community, he holds 14 patents, has published 17 scientific papers, and has sat on multiple peer review panels. Dr. Chen leads Interlink's R&D and materials science laboratory in Camarillo, California, and directs Interlink's global engineering team.- Gene Chen，2021年5月加入Interlink，担任互联电子公司工程与先进材料副总裁。陈博士在先进材料和电子设备领域拥有超过20年的经验，并在各种技术领域担任领导职务，包括力传感和人机界面（HMI）技术。在加入Interlink之前，他于2016年至2021年担任力传感器公司New Degree Technology的CTO，领导该公司的研发和产品开发团队。在此之前，他是Pixelligent Technologies，LLC的创始成员，并于2009年至2016年担任工程副总裁。他拥有多元化、跨学科的背景，还担任过管理纳米材料和先进材料项目的职务，这些材料的应用范围从LED和OLED到半导体，再到宇宙飞船的介质涂层。陈博士还曾在美国国家科学基金会和能源部的众多资助评审小组任职。陈博士在马里兰大学帕克分校获得电气工程哲学博士学位，主要研究电子物理和微电子学。作为科学界的活跃成员，他拥有14项专利，发表了17篇科学论文，并参加过多个同行评审团。陈博士领导Interlink位于加利福尼亚州卡马里洛的研发和材料科学实验室，并领导Interlink的全球工程团队。
- Gene Chen,joined Interlink in May 2021 as Interlink Electronics, Inc. Vice President of Engineering & Advanced Materials. Dr. Chen has more than two decades of experience in advanced materials and electronic devices and has taken leadership roles in a wide variety of technical fields, including force sensing and human machine interface (HMI) technology. Prior to joining Interlink, from 2016 to 2021 he was CTO at force sensor company New Degree Technology, where he led its R&D and product development teams. Prior to that, he was the founding member of Pixelligent Technologies, LLC and served as VP of Engineering from 2009 to 2016. His diverse, interdisciplinary background has also included roles managing projects working on nanomaterials and advanced materials for applications ranging from LEDs and OLEDs to semiconductors to dielectric coatings for spaceships. Dr. Chen has also served on numerous grant review panels for the National Science Foundation and Department of Energy. Dr. Chen earned a doctorate of philosophy in electrical engineering – focusing on electro-physics and microelectronics – from the University of Maryland, College Park. An active member of the scientific community, he holds 14 patents, has published 17 scientific papers, and has sat on multiple peer review panels. Dr. Chen leads Interlink's R&D and materials science laboratory in Camarillo, California, and directs Interlink's global engineering team.
- Ryan J. Hoffman
Ryan J. Hoffman自2020年11月起担任互联电子公司首席财务官，加入Interlink后，在两家全球顶级公共会计师事务所积累了超过20年的审计和专业服务经验。此前，他在会计师事务所RSM US LLP工作了16年，并在过去5年担任合伙人。在RSM，他成功地领导了对技术、消费品和制造业等行业的全球公司的审计，并培养了软件和多要素收入确认会计和审计方面的专业人才。在此之前，他曾在四大会计师事务所安永工作。Hoffman先生毕业于查普曼大学，获得会计学学位，是一名注册会计师（非在职）。他还是Qualstar Corporation（OTCMKTS：QBAK）和BKFCapital Group公司（OTCMKTS：BKFG）的首席财务官。
Ryan J. Hoffman,has served as Interlink Electronics, Inc. Chief Financial Officer since November 2020, joining Interlink with more than two decades of auditing and professional services experience accrued at two top global public accounting firms. He previously spent 16 years at the accounting firm RSM US LLP and was a partner there for his last five years. At RSM, he successfully led audits of global companies in industries that include technology, consumer products, and manufacturing, and cultivated a specialization in software and multiple-element revenue recognition accounting and auditing. Prior to that, he worked for the Big Four accounting firm Ernst & Young. Mr. Hoffman graduated with a degree in accounting from Chapman University and is a licensed CPA (inactive). He is also the Chief Financial Officer of Qualstar Corporation (OTCMKTS: QBAK) and BKF Capital Group, Inc. (OTCMKTS: BKFG).- Ryan J. Hoffman自2020年11月起担任互联电子公司首席财务官，加入Interlink后，在两家全球顶级公共会计师事务所积累了超过20年的审计和专业服务经验。此前，他在会计师事务所RSM US LLP工作了16年，并在过去5年担任合伙人。在RSM，他成功地领导了对技术、消费品和制造业等行业的全球公司的审计，并培养了软件和多要素收入确认会计和审计方面的专业人才。在此之前，他曾在四大会计师事务所安永工作。Hoffman先生毕业于查普曼大学，获得会计学学位，是一名注册会计师（非在职）。他还是Qualstar Corporation（OTCMKTS：QBAK）和BKFCapital Group公司（OTCMKTS：BKFG）的首席财务官。
- Ryan J. Hoffman,has served as Interlink Electronics, Inc. Chief Financial Officer since November 2020, joining Interlink with more than two decades of auditing and professional services experience accrued at two top global public accounting firms. He previously spent 16 years at the accounting firm RSM US LLP and was a partner there for his last five years. At RSM, he successfully led audits of global companies in industries that include technology, consumer products, and manufacturing, and cultivated a specialization in software and multiple-element revenue recognition accounting and auditing. Prior to that, he worked for the Big Four accounting firm Ernst & Young. Mr. Hoffman graduated with a degree in accounting from Chapman University and is a licensed CPA (inactive). He is also the Chief Financial Officer of Qualstar Corporation (OTCMKTS: QBAK) and BKF Capital Group, Inc. (OTCMKTS: BKFG).
- Steven N. Bronson
Steven N. Bronson，他于2013年7月3日被任命为首席执行官。他和他的BKF Capital Group公司拥有23.4的Qualstar股票。他一直担任BKF公司的主席兼首席执行官（2008年10月以来）。他于2010年7月成为Interlink Electronics公司（Force-Sensing Resistor（FSR）技术的全球领先设计专利和印刷电子产品的先驱）的主席兼首席执行官。自1996年以来，他一直担任Bronson & Co.（投资银行公司，建议私人和上市、新兴市场增长和中产公司）的董事长兼首席执行官。此外，他曾担任Mikron Infrared Instruments公司的主席兼首席执行官（从1998年8月到1999年5月他成功地重组和出售）。
Steven N. Bronson,has over 35 years of business and entrepreneurial experience. His successful background in investment banking, operations, and management has led him to acquire meaningful stakes in several promising technology companies and assume CEO roles. Mr. Bronson became the Chairman and CEO of Interlink Electronics in 2010 and took on the role of President less than a year later.In July 2013, Mr. Bronson assumed the positions of President and CEO of Qualstar Corporation (OTCMKTS: QBAK)—a high-quality tape library manufacturer—and its subsidiary N2Power, a manufacturer of high efficiency power supplies for diverse electronics industries. He immediately initiated a turnaround strategy, implementing cost-cutting measures and aggressive sales efforts. Since 2008, Mr. Bronson has held the position of Chairman, President, and CEO of BKF Capital Group, Inc. (OTCMKTS: BKFG) a publicly traded company operating through its wholly-owned subsidiaries, BKF Asset Holdings, Inc., which invests in publicly and privately owned businesses, and Bronson Financial LLC, a FINRA member investment banking firm (providing M&A advisory and capital raising services to lower and middle-market companies). In addition, Mr. Bronson served on the board of Mikron Infrared Instruments, Inc. from September 1996 to July 2000. During a restructuring period spanning August 1998 to May 1999, he was appointed Mikron's Chairman and CEO. Mr. Bronson led the effort of recruiting a top-notch management team, eventually increasing the company's revenue by 500 percent; it was sold in April 2007. Mr. Bronson has also served as the Chairman, President, and Chief Executive Officer of Ridgefield Acquisition Corp. (OTCMKTS: RDGA) since 1996. Ridgefield Acquisition Corp. is a public shell that is seeking a merger, acquisition, or business combination with a viable operating entity. Mr. Bronson currently holds the Series 4, 7, 24, 27, 53, 55, and 79 licenses.- Steven N. Bronson，他于2013年7月3日被任命为首席执行官。他和他的BKF Capital Group公司拥有23.4的Qualstar股票。他一直担任BKF公司的主席兼首席执行官（2008年10月以来）。他于2010年7月成为Interlink Electronics公司（Force-Sensing Resistor（FSR）技术的全球领先设计专利和印刷电子产品的先驱）的主席兼首席执行官。自1996年以来，他一直担任Bronson & Co.（投资银行公司，建议私人和上市、新兴市场增长和中产公司）的董事长兼首席执行官。此外，他曾担任Mikron Infrared Instruments公司的主席兼首席执行官（从1998年8月到1999年5月他成功地重组和出售）。
- Steven N. Bronson,has over 35 years of business and entrepreneurial experience. His successful background in investment banking, operations, and management has led him to acquire meaningful stakes in several promising technology companies and assume CEO roles. Mr. Bronson became the Chairman and CEO of Interlink Electronics in 2010 and took on the role of President less than a year later.In July 2013, Mr. Bronson assumed the positions of President and CEO of Qualstar Corporation (OTCMKTS: QBAK)—a high-quality tape library manufacturer—and its subsidiary N2Power, a manufacturer of high efficiency power supplies for diverse electronics industries. He immediately initiated a turnaround strategy, implementing cost-cutting measures and aggressive sales efforts. Since 2008, Mr. Bronson has held the position of Chairman, President, and CEO of BKF Capital Group, Inc. (OTCMKTS: BKFG) a publicly traded company operating through its wholly-owned subsidiaries, BKF Asset Holdings, Inc., which invests in publicly and privately owned businesses, and Bronson Financial LLC, a FINRA member investment banking firm (providing M&A advisory and capital raising services to lower and middle-market companies). In addition, Mr. Bronson served on the board of Mikron Infrared Instruments, Inc. from September 1996 to July 2000. During a restructuring period spanning August 1998 to May 1999, he was appointed Mikron's Chairman and CEO. Mr. Bronson led the effort of recruiting a top-notch management team, eventually increasing the company's revenue by 500 percent; it was sold in April 2007. Mr. Bronson has also served as the Chairman, President, and Chief Executive Officer of Ridgefield Acquisition Corp. (OTCMKTS: RDGA) since 1996. Ridgefield Acquisition Corp. is a public shell that is seeking a merger, acquisition, or business combination with a viable operating entity. Mr. Bronson currently holds the Series 4, 7, 24, 27, 53, 55, and 79 licenses.