董事介绍

注:董事持股数取自最新公司公告

姓名 性别 职位 年龄 薪酬 持股数(万股) 截止日期
Steve Sanghi Executive Chair of the Board, Chief Executive Officer and President 69 2141.45万美元 1017.18 2025-08-19
Karen M. Rapp Independent Director 57 31.42万美元 1.11 2025-08-19
Ellen Barker -- Independent Director 62 29.78万美元 0.38 2025-08-19
Victor Peng -- Independent Director 65 未披露 未持股 2025-08-19
Matthew W. Chapman Lead Independent Director 74 33.94万美元 4.07 2025-08-19
Victor Peng Independent Director 65 11.49万美元 0.23 2025-08-19
Rick Cassidy Independent Director 73 未披露 0.13 2025-08-19

高管介绍

注:高管持股数取自最新公司公告

姓名 性别 职位 年龄 薪酬 持股数(万股) 截止日期
Steve Sanghi Executive Chair of the Board, Chief Executive Officer and President 69 2141.45万美元 1017.18 2025-08-19
Mathew B. Bunker Senior Vice President, Operations 55 146.30万美元 3.03 2025-08-19
Joseph R. Krawczyk II Senior Vice President, Worldwide Client Engagement 65 118.30万美元 1.69 2025-08-19
J. Eric Bjornholt Senior Vice President and Chief Financial Officer 54 187.91万美元 3.97 2025-08-19
Richard J. Simoncic Chief Operating Officer 61 345.44万美元 15.43 2025-08-19

董事简历

中英对照 |  中文 |  英文
Steve Sanghi

Steve Sanghi,自1990年以来在微芯科技公司拥有非凡的职业生涯,该公司是一家专注于微控制器、混合信号、模拟和Flash-IP解决方案的公司。他目前担任临时首席执行官兼总裁,自2024年以来一直担任这一职务。此前,他于2021年至2024年担任执行主席,并于1991年至2021年担任首席执行官。此外,他还曾于1990年至2016年担任总裁一职,并于1990年至1991年担任首席运营官。在任职Microchip之前,Steve于1988年至1990年在Waferscale Integration,Inc.担任运营副总裁。他还曾于1978年至1988年在英特尔公司工作了十年,担任可编程存储器运营总经理等职务。除了公司成就之外,Steve还担任射频识别(RFID)设备和软件制造商Impinj, Inc.的董事会成员。他也是一位出版作家,于2022年12月获得全球半导体联盟颁发的Morris Chang博士模范领导力奖。为了表彰他的贡献,北亚利桑那大学将他们的工程、信息学和应用科学学院更名为Steve Sanghi工程学院。


Steve Sanghi,served as Chief Executive Officer from October 1991 to March 2021, as Chair of the Board from October 1993 to March 2021 and August 2024 to November 2024, and as Executive Chair of the Board from March 2021 to August 2024, and from November 2024 to present. He served as President from August 1990 to February 2016 and has served as a director since August 1990. Mr. Sanghi holds an M.S. degree in Electrical and Computer Engineering from the University of Massachusetts and a B.S. degree in Electronics and Communication from Punjab University. Mr. Sanghi served on the Board of Directors of Myomo, Inc., a publicly traded commercial stage medical robotics company that offers expanded mobility for those suffering from neurological disorders and upper-limb paralysis, from November 2016 through October 2019. Mr. Sanghi served on the board of Mellanox Technologies Ltd., a publicly traded supplier of end-to-end Ethernet and InfiniBand intelligent interconnect solutions and services for servers, storage, and hyper-converged infrastructure, from February 2018 through April 2020. Mr. Sanghi was elected to the Board of Directors of Impinj, Inc. in March 2021 and assumed the role of Board Chair in June 2022. Mr. Sanghi was elected to the Board of Directors of Intel Corporation in December 2024.
Steve Sanghi,自1990年以来在微芯科技公司拥有非凡的职业生涯,该公司是一家专注于微控制器、混合信号、模拟和Flash-IP解决方案的公司。他目前担任临时首席执行官兼总裁,自2024年以来一直担任这一职务。此前,他于2021年至2024年担任执行主席,并于1991年至2021年担任首席执行官。此外,他还曾于1990年至2016年担任总裁一职,并于1990年至1991年担任首席运营官。在任职Microchip之前,Steve于1988年至1990年在Waferscale Integration,Inc.担任运营副总裁。他还曾于1978年至1988年在英特尔公司工作了十年,担任可编程存储器运营总经理等职务。除了公司成就之外,Steve还担任射频识别(RFID)设备和软件制造商Impinj, Inc.的董事会成员。他也是一位出版作家,于2022年12月获得全球半导体联盟颁发的Morris Chang博士模范领导力奖。为了表彰他的贡献,北亚利桑那大学将他们的工程、信息学和应用科学学院更名为Steve Sanghi工程学院。
Steve Sanghi,served as Chief Executive Officer from October 1991 to March 2021, as Chair of the Board from October 1993 to March 2021 and August 2024 to November 2024, and as Executive Chair of the Board from March 2021 to August 2024, and from November 2024 to present. He served as President from August 1990 to February 2016 and has served as a director since August 1990. Mr. Sanghi holds an M.S. degree in Electrical and Computer Engineering from the University of Massachusetts and a B.S. degree in Electronics and Communication from Punjab University. Mr. Sanghi served on the Board of Directors of Myomo, Inc., a publicly traded commercial stage medical robotics company that offers expanded mobility for those suffering from neurological disorders and upper-limb paralysis, from November 2016 through October 2019. Mr. Sanghi served on the board of Mellanox Technologies Ltd., a publicly traded supplier of end-to-end Ethernet and InfiniBand intelligent interconnect solutions and services for servers, storage, and hyper-converged infrastructure, from February 2018 through April 2020. Mr. Sanghi was elected to the Board of Directors of Impinj, Inc. in March 2021 and assumed the role of Board Chair in June 2022. Mr. Sanghi was elected to the Board of Directors of Intel Corporation in December 2024.
Karen M. Rapp

Karen M. Rapp自2021年1月起担任Microchip的董事。自2017年起,她担任国家仪器公司(National Instruments Corporation)的首席财务官,National Instruments Corporation是一家专门从事自动化测试和测量系统的上市公司。2015年12月,恩智浦收购飞思卡尔半导体后,Rapp女士担任荷兰全球半导体制造商NXP Semiconductors N.V。“NXP”的企业发展高级副总裁。Rapp女士曾在飞思卡尔担任多个职位,自2013年4月至2015年12月担任副总裁兼首席信息官,并于2010年4月至2013年4月担任全球运营与营销总监,Rapp女士持有伊利诺斯北方大学金融学学士学位,并获得克萨斯大学奥斯汀分校工商管理硕士学位。Rapp女士自2018年3月起担任Plexus Corp.董事会成员以及审计委员会和薪酬委员会成员。


Karen M. Rapp retired as Executive Vice President and Chief Financial Officer of National Instruments Corp., a producer of automated test equipment and virtual instrumentation software, in May 2023. Ms. Rapp also previoly served as National Instruments' Treasurer. Prior thereto, she served as the Senior Vice President of Corporate Development at NXP Semiconductors N.V., a global semiconductor company and a long standing supplier in the indtry, where she led the integration efforts for the NXP/Freescale Semiconductor, Ltd. merger, from 2015 to 2017. Prior to the merger, Ms. Rapp held several leadership positions at Freescale with increasing responsibility, including Vice President and Chief Information Officer, Director of Operations and Finance, Global Sales and Marketing, Director of Finance, Supply Chain, and Director of Finance, Continuo Development. Ms. Rapp is a director of Microchip Technology Incorporated, a leading provider of smart, connected and secure embedded control solutions, as ll as the chair of its Audit Committee. Ms. Rapp is also a director at Cohu, Inc., a global technology company supplying test, automation, inspection and metrology products and services to the semiconductor indtry, and is a member of its Audit Committee. Ms. Rapp holds an M.B.A. from The University of Texas at Atin and a B.S. in Finance from Northern Illinois University.
Karen M. Rapp自2021年1月起担任Microchip的董事。自2017年起,她担任国家仪器公司(National Instruments Corporation)的首席财务官,National Instruments Corporation是一家专门从事自动化测试和测量系统的上市公司。2015年12月,恩智浦收购飞思卡尔半导体后,Rapp女士担任荷兰全球半导体制造商NXP Semiconductors N.V。“NXP”的企业发展高级副总裁。Rapp女士曾在飞思卡尔担任多个职位,自2013年4月至2015年12月担任副总裁兼首席信息官,并于2010年4月至2013年4月担任全球运营与营销总监,Rapp女士持有伊利诺斯北方大学金融学学士学位,并获得克萨斯大学奥斯汀分校工商管理硕士学位。Rapp女士自2018年3月起担任Plexus Corp.董事会成员以及审计委员会和薪酬委员会成员。
Karen M. Rapp retired as Executive Vice President and Chief Financial Officer of National Instruments Corp., a producer of automated test equipment and virtual instrumentation software, in May 2023. Ms. Rapp also previoly served as National Instruments' Treasurer. Prior thereto, she served as the Senior Vice President of Corporate Development at NXP Semiconductors N.V., a global semiconductor company and a long standing supplier in the indtry, where she led the integration efforts for the NXP/Freescale Semiconductor, Ltd. merger, from 2015 to 2017. Prior to the merger, Ms. Rapp held several leadership positions at Freescale with increasing responsibility, including Vice President and Chief Information Officer, Director of Operations and Finance, Global Sales and Marketing, Director of Finance, Supply Chain, and Director of Finance, Continuo Development. Ms. Rapp is a director of Microchip Technology Incorporated, a leading provider of smart, connected and secure embedded control solutions, as ll as the chair of its Audit Committee. Ms. Rapp is also a director at Cohu, Inc., a global technology company supplying test, automation, inspection and metrology products and services to the semiconductor indtry, and is a member of its Audit Committee. Ms. Rapp holds an M.B.A. from The University of Texas at Atin and a B.S. in Finance from Northern Illinois University.
Ellen Barker

Ellen Barker,2024年2月至今-微芯片技术公司董事会。2017年至2021年-德克萨斯仪器公司高级副总裁兼首席信息官。2014年至2016年-德克萨斯器械公司副总裁兼总裁信息官。2011年至2014年-德克萨斯工具公司副总裁、控制器和国家半导体集成经理。达拉斯大学工商管理硕士。德克萨斯大学工商管理学士。


Ellen Barker,2024 to Present - Board of Directors, Microchip Technology Incorporated;2017 to 2021 - Senior Vice President and Chief Information Officer, Texas Instruments;2014 to 2016 - Vice President, Chief Information Officer, Texas Instruments;2011 to 2014 - Vice President, Controller and National Semiconductor Integration Manager, Texas Instruments.Education:M.B.A in Business Administration from the University of Dallas,B.A. in Business Administration from the University of Texas.
Ellen Barker,2024年2月至今-微芯片技术公司董事会。2017年至2021年-德克萨斯仪器公司高级副总裁兼首席信息官。2014年至2016年-德克萨斯器械公司副总裁兼总裁信息官。2011年至2014年-德克萨斯工具公司副总裁、控制器和国家半导体集成经理。达拉斯大学工商管理硕士。德克萨斯大学工商管理学士。
Ellen Barker,2024 to Present - Board of Directors, Microchip Technology Incorporated;2017 to 2021 - Senior Vice President and Chief Information Officer, Texas Instruments;2014 to 2016 - Vice President, Chief Information Officer, Texas Instruments;2011 to 2014 - Vice President, Controller and National Semiconductor Integration Manager, Texas Instruments.Education:M.B.A in Business Administration from the University of Dallas,B.A. in Business Administration from the University of Texas.
Victor Peng

Victor Peng, 2025年2月至今- Microchip Technology Incorporated董事,2022年至2024年- Advanced Micro Devices, Inc总裁,2018年至2022年- Xilinx Inc.首席执行官。康奈尔大学电气工程学士学位伦斯勒理工学院电气工程专业。


Victor Peng,February 2025 to Present - Director, Microchip Technology Incorporated,2022 to 2024 - President, Advanced Micro Devices, Inc.,2018 to 2022 - Xilinx Inc., CEO.Education:M.Eng. in Electrical Engineering from Cornell University,B.S. in Electrical Engineering from Rensselaer Polytechnic Institute.
Victor Peng, 2025年2月至今- Microchip Technology Incorporated董事,2022年至2024年- Advanced Micro Devices, Inc总裁,2018年至2022年- Xilinx Inc.首席执行官。康奈尔大学电气工程学士学位伦斯勒理工学院电气工程专业。
Victor Peng,February 2025 to Present - Director, Microchip Technology Incorporated,2022 to 2024 - President, Advanced Micro Devices, Inc.,2018 to 2022 - Xilinx Inc., CEO.Education:M.Eng. in Electrical Engineering from Cornell University,B.S. in Electrical Engineering from Rensselaer Polytechnic Institute.
Matthew W. Chapman

Matthew W. Chapman,1997年至今,担任Microchip Technology Incorporated董事会成员;1997年以来担任审计委员会主席;2002年至2006年,担任Northwest Evaluation Association(一家非营利性教育服务组织,为美国和其他140个国家的数百万学生提供计算机适应性测试)的首席执行官;Centrisoft(一家私营软件公司,为大规模网络提供带宽管理)的主席兼首席执行官。1987年至2000年,担任Concentrex Incorporated的首席执行官,Concentrex Incorporated后来成为一家上市公司,专门为美国金融机构提供软件解决方案和服务。Matthew W. Chapman获得Oregon大学法学院法学博士和Portland大学经济学学士学位。


Matthew W. Chapman,1997 to Present - Board of Directors, Microchip Technology Incorporated; Audit Committee Chair since 1997; Lead Independent Director since 2024,2007 to 2018 - CEO of Northwest Evaluation Association, a not-for-profit education services organization providing computer adaptive testing for millions of students throughout the United States and in 140 other countries,2002 to 2006 - Chair and CEO of Centrisoft, a privately held software company providing bandwidth management for large-scale networks.1987 to 2000 - CEO of Concentrex Incorporated, which became a publicly held company specializing in supplying software solutions and service to U.S. financial institutions.Education:J.D. from the University of Oregon School of Law,B.S. in Economics from the University of Portland.
Matthew W. Chapman,1997年至今,担任Microchip Technology Incorporated董事会成员;1997年以来担任审计委员会主席;2002年至2006年,担任Northwest Evaluation Association(一家非营利性教育服务组织,为美国和其他140个国家的数百万学生提供计算机适应性测试)的首席执行官;Centrisoft(一家私营软件公司,为大规模网络提供带宽管理)的主席兼首席执行官。1987年至2000年,担任Concentrex Incorporated的首席执行官,Concentrex Incorporated后来成为一家上市公司,专门为美国金融机构提供软件解决方案和服务。Matthew W. Chapman获得Oregon大学法学院法学博士和Portland大学经济学学士学位。
Matthew W. Chapman,1997 to Present - Board of Directors, Microchip Technology Incorporated; Audit Committee Chair since 1997; Lead Independent Director since 2024,2007 to 2018 - CEO of Northwest Evaluation Association, a not-for-profit education services organization providing computer adaptive testing for millions of students throughout the United States and in 140 other countries,2002 to 2006 - Chair and CEO of Centrisoft, a privately held software company providing bandwidth management for large-scale networks.1987 to 2000 - CEO of Concentrex Incorporated, which became a publicly held company specializing in supplying software solutions and service to U.S. financial institutions.Education:J.D. from the University of Oregon School of Law,B.S. in Economics from the University of Portland.
Victor Peng

Victor Peng, 2008年4月加入公司担任硅工程集团高级副总裁并在2008年11月成为可编程平台开发高级副总裁。加入公司之前,他从2005年11月到2008年4月担任高级微设备公司(一家处理方案供应商)图形产品集团副总裁。加入高级微设备公司之前他在半导体和处理行业公司担任多个行政管理职位。


Victor Peng has served as a director since February 2026. Mr. Peng currently serves as a member of Compensation Committee. Mr. Peng is an accomplished executive with more than 40 years of leadership experience at top semiconductor companies. From 2022 to 2024, Mr. Peng served as president of Advanced Micro Devices ("AMD"), leading AMD's embedded and data center GPU binesses, AI software, and the research and advanced development group. Prior to AMD, Mr. Peng served 14 years at Xilinx, Inc., holding senior level positions including president and chief executive officer, board member, chief operating officer, executive vice president, and general manager of products from 2008 to 2022. Mr. Peng currently serves on the Boards of KLA Corporation and Microchip Technology Inc. Mr. Peng holds a Master of Engineering in electrical engineering from Cornell University, and a Bachelor of Science in electrical engineering from Rensselaer Polytechnic Institute.
Victor Peng, 2008年4月加入公司担任硅工程集团高级副总裁并在2008年11月成为可编程平台开发高级副总裁。加入公司之前,他从2005年11月到2008年4月担任高级微设备公司(一家处理方案供应商)图形产品集团副总裁。加入高级微设备公司之前他在半导体和处理行业公司担任多个行政管理职位。
Victor Peng has served as a director since February 2026. Mr. Peng currently serves as a member of Compensation Committee. Mr. Peng is an accomplished executive with more than 40 years of leadership experience at top semiconductor companies. From 2022 to 2024, Mr. Peng served as president of Advanced Micro Devices ("AMD"), leading AMD's embedded and data center GPU binesses, AI software, and the research and advanced development group. Prior to AMD, Mr. Peng served 14 years at Xilinx, Inc., holding senior level positions including president and chief executive officer, board member, chief operating officer, executive vice president, and general manager of products from 2008 to 2022. Mr. Peng currently serves on the Boards of KLA Corporation and Microchip Technology Inc. Mr. Peng holds a Master of Engineering in electrical engineering from Cornell University, and a Bachelor of Science in electrical engineering from Rensselaer Polytechnic Institute.
Rick Cassidy

Rick Cassidy,现任本公司的TSMC高级副总裁、TSMC北美地区总裁。2014年2月,他晋升为高级副总裁;2008年2月至2014年2月,担任TSMC的副总裁、TSMC北美地区总裁;2005年1月至2008年2月,担任TSMC北美地区总裁。他于1997年加入本公司,在TSMC北美地区担任过各种职务,涉及商业运营、现场技术支持、商务管理。他在United States Military Academy at West Point获得工程技术学士学位。


Rick Cassidy,was Taiwan Semiconductor Manufacturing Company Limited Senior Vice President of Corporate Strategy Office from January 2019 to February 2024 and CEO & President of TSMC Arizona from December 2020 to March 2023. Prior to that, he served as Chief Executive Officer of TSMC North America from 2017 to January 2019. He was promoted to Senior Vice President in February 2014, Vice President in November 2008 and had led TSMC North America from January 2005 to 2018. He joined Taiwan Semiconductor Manufacturing Company Limited in 1997 and has held various positions in TSMC North America, including Business Operations, Field Technical Support, and Business Management. He holds a B.A. degree in engineering technology from United States Military Academy at West Point.
Rick Cassidy,现任本公司的TSMC高级副总裁、TSMC北美地区总裁。2014年2月,他晋升为高级副总裁;2008年2月至2014年2月,担任TSMC的副总裁、TSMC北美地区总裁;2005年1月至2008年2月,担任TSMC北美地区总裁。他于1997年加入本公司,在TSMC北美地区担任过各种职务,涉及商业运营、现场技术支持、商务管理。他在United States Military Academy at West Point获得工程技术学士学位。
Rick Cassidy,was Taiwan Semiconductor Manufacturing Company Limited Senior Vice President of Corporate Strategy Office from January 2019 to February 2024 and CEO & President of TSMC Arizona from December 2020 to March 2023. Prior to that, he served as Chief Executive Officer of TSMC North America from 2017 to January 2019. He was promoted to Senior Vice President in February 2014, Vice President in November 2008 and had led TSMC North America from January 2005 to 2018. He joined Taiwan Semiconductor Manufacturing Company Limited in 1997 and has held various positions in TSMC North America, including Business Operations, Field Technical Support, and Business Management. He holds a B.A. degree in engineering technology from United States Military Academy at West Point.

高管简历

中英对照 |  中文 |  英文
Steve Sanghi

Steve Sanghi,自1990年以来在微芯科技公司拥有非凡的职业生涯,该公司是一家专注于微控制器、混合信号、模拟和Flash-IP解决方案的公司。他目前担任临时首席执行官兼总裁,自2024年以来一直担任这一职务。此前,他于2021年至2024年担任执行主席,并于1991年至2021年担任首席执行官。此外,他还曾于1990年至2016年担任总裁一职,并于1990年至1991年担任首席运营官。在任职Microchip之前,Steve于1988年至1990年在Waferscale Integration,Inc.担任运营副总裁。他还曾于1978年至1988年在英特尔公司工作了十年,担任可编程存储器运营总经理等职务。除了公司成就之外,Steve还担任射频识别(RFID)设备和软件制造商Impinj, Inc.的董事会成员。他也是一位出版作家,于2022年12月获得全球半导体联盟颁发的Morris Chang博士模范领导力奖。为了表彰他的贡献,北亚利桑那大学将他们的工程、信息学和应用科学学院更名为Steve Sanghi工程学院。


Steve Sanghi,served as Chief Executive Officer from October 1991 to March 2021, as Chair of the Board from October 1993 to March 2021 and August 2024 to November 2024, and as Executive Chair of the Board from March 2021 to August 2024, and from November 2024 to present. He served as President from August 1990 to February 2016 and has served as a director since August 1990. Mr. Sanghi holds an M.S. degree in Electrical and Computer Engineering from the University of Massachusetts and a B.S. degree in Electronics and Communication from Punjab University. Mr. Sanghi served on the Board of Directors of Myomo, Inc., a publicly traded commercial stage medical robotics company that offers expanded mobility for those suffering from neurological disorders and upper-limb paralysis, from November 2016 through October 2019. Mr. Sanghi served on the board of Mellanox Technologies Ltd., a publicly traded supplier of end-to-end Ethernet and InfiniBand intelligent interconnect solutions and services for servers, storage, and hyper-converged infrastructure, from February 2018 through April 2020. Mr. Sanghi was elected to the Board of Directors of Impinj, Inc. in March 2021 and assumed the role of Board Chair in June 2022. Mr. Sanghi was elected to the Board of Directors of Intel Corporation in December 2024.
Steve Sanghi,自1990年以来在微芯科技公司拥有非凡的职业生涯,该公司是一家专注于微控制器、混合信号、模拟和Flash-IP解决方案的公司。他目前担任临时首席执行官兼总裁,自2024年以来一直担任这一职务。此前,他于2021年至2024年担任执行主席,并于1991年至2021年担任首席执行官。此外,他还曾于1990年至2016年担任总裁一职,并于1990年至1991年担任首席运营官。在任职Microchip之前,Steve于1988年至1990年在Waferscale Integration,Inc.担任运营副总裁。他还曾于1978年至1988年在英特尔公司工作了十年,担任可编程存储器运营总经理等职务。除了公司成就之外,Steve还担任射频识别(RFID)设备和软件制造商Impinj, Inc.的董事会成员。他也是一位出版作家,于2022年12月获得全球半导体联盟颁发的Morris Chang博士模范领导力奖。为了表彰他的贡献,北亚利桑那大学将他们的工程、信息学和应用科学学院更名为Steve Sanghi工程学院。
Steve Sanghi,served as Chief Executive Officer from October 1991 to March 2021, as Chair of the Board from October 1993 to March 2021 and August 2024 to November 2024, and as Executive Chair of the Board from March 2021 to August 2024, and from November 2024 to present. He served as President from August 1990 to February 2016 and has served as a director since August 1990. Mr. Sanghi holds an M.S. degree in Electrical and Computer Engineering from the University of Massachusetts and a B.S. degree in Electronics and Communication from Punjab University. Mr. Sanghi served on the Board of Directors of Myomo, Inc., a publicly traded commercial stage medical robotics company that offers expanded mobility for those suffering from neurological disorders and upper-limb paralysis, from November 2016 through October 2019. Mr. Sanghi served on the board of Mellanox Technologies Ltd., a publicly traded supplier of end-to-end Ethernet and InfiniBand intelligent interconnect solutions and services for servers, storage, and hyper-converged infrastructure, from February 2018 through April 2020. Mr. Sanghi was elected to the Board of Directors of Impinj, Inc. in March 2021 and assumed the role of Board Chair in June 2022. Mr. Sanghi was elected to the Board of Directors of Intel Corporation in December 2024.
Mathew B. Bunker

Mathew B. Bunker,2019年晋升为高级副总裁,自2007年5月起担任后端运营和其他后端制造部门的副总裁。他自1993年2月起受雇于微芯生物,自2007年5月起担任副总裁,担任多个职务。Bunker先生拥有凤凰城大学技术管理硕士学位和亚利桑那州立大学电气工程学士学位。


Mathew B. Bunker,was promoted to Senior Vice President in 2019 and has served as Vice President of Backend Operations and other backend manufacturing divisions since May 2007. He has been employed by Microchip since February 1993 and has served as a Vice President in various roles since May 2007. Mr. Bunker holds a Master's degree in Technology Management from University of Phoenix and a B.S. degree in Electrical Engineering from Arizona State University.
Mathew B. Bunker,2019年晋升为高级副总裁,自2007年5月起担任后端运营和其他后端制造部门的副总裁。他自1993年2月起受雇于微芯生物,自2007年5月起担任副总裁,担任多个职务。Bunker先生拥有凤凰城大学技术管理硕士学位和亚利桑那州立大学电气工程学士学位。
Mathew B. Bunker,was promoted to Senior Vice President in 2019 and has served as Vice President of Backend Operations and other backend manufacturing divisions since May 2007. He has been employed by Microchip since February 1993 and has served as a Vice President in various roles since May 2007. Mr. Bunker holds a Master's degree in Technology Management from University of Phoenix and a B.S. degree in Electrical Engineering from Arizona State University.
Joseph R. Krawczyk II

Joseph R. Krawczyk II,2022年晋升为高级副总裁,自2021年5月起担任WW客户参与副总裁。他曾于2006年至2020年担任亚洲客户参与副总裁。自1995年9月加入MicroChip以来,Krawczyk先生担任过各种营销和地域销售职务。Krawczyk先生拥有圣爱德华大学商学硕士学位和南密西西比大学计算机技术学士学位。


Joseph R. Krawczyk II,was promoted to Senior Vice President in 2022 and has served as Vice President of WW Client Engagement since May 2021. He served as Vice President of Asia Client Engagement from 2006 to 2020. Since joining Microchip in September 1995, Mr. Krawczyk held various marketing and geographical sales roles. Mr. Krawczyk holds a Master's degree in Business from St. Edward's University and a B.S. degree in Computer Technology from University of Southern Mississippi.
Joseph R. Krawczyk II,2022年晋升为高级副总裁,自2021年5月起担任WW客户参与副总裁。他曾于2006年至2020年担任亚洲客户参与副总裁。自1995年9月加入MicroChip以来,Krawczyk先生担任过各种营销和地域销售职务。Krawczyk先生拥有圣爱德华大学商学硕士学位和南密西西比大学计算机技术学士学位。
Joseph R. Krawczyk II,was promoted to Senior Vice President in 2022 and has served as Vice President of WW Client Engagement since May 2021. He served as Vice President of Asia Client Engagement from 2006 to 2020. Since joining Microchip in September 1995, Mr. Krawczyk held various marketing and geographical sales roles. Mr. Krawczyk holds a Master's degree in Business from St. Edward's University and a B.S. degree in Computer Technology from University of Southern Mississippi.
J. Eric Bjornholt

J. Eric Bjornholt, 自2008年起担任财务副总裁;自2009年1月1日起,担任首席财务官。自从1995年加入了微芯科技公司以来,他担任各种财务管理职务。他持有亚利桑那州立大学的税务硕士学位和亚利桑那大学的会计学士学位。


J. Eric Bjornholt,was promoted to Senior Vice President in 2019 and has served as Vice President of Finance since 2008 and as Chief Financial Officer since January 2009. He has served in various financial management capacities since he joined Microchip in 1995. Mr. Bjornholt holds a Master's degree in Taxation from Arizona State University and a B.S. degree in Accounting from the University of Arizona.
J. Eric Bjornholt, 自2008年起担任财务副总裁;自2009年1月1日起,担任首席财务官。自从1995年加入了微芯科技公司以来,他担任各种财务管理职务。他持有亚利桑那州立大学的税务硕士学位和亚利桑那大学的会计学士学位。
J. Eric Bjornholt,was promoted to Senior Vice President in 2019 and has served as Vice President of Finance since 2008 and as Chief Financial Officer since January 2009. He has served in various financial management capacities since he joined Microchip in 1995. Mr. Bjornholt holds a Master's degree in Taxation from Arizona State University and a B.S. degree in Accounting from the University of Arizona.
Richard J. Simoncic

Richard J. Simoncic, 自1999年9月起一直担任微芯科技公司的副总裁,负责模拟和接口产品部工作 。从1995年10月至1999年9月,他担任副总裁,负责了公司的各项工作。他于1990年加入公司,之后担任各种工作,包括设计、设备/收益工程和质量系统。他拥有德锐技术学院的电气工程技术学位。


Richard J. Simoncic has served as Chief Operating Officer of Microchip Technology Inc. (NASDAQ: MCHP) since April 1, 2024. Microchip is a leading provider of smart, connected and secure embedded control solutions. He served as Microchip's Executive Vice President Analog Por and Interface Biness Unit from April 2023 to April 2024; as Senior Vice President, Analog Por and Interface Biness Units from February 2019 to April 2023; and as Vice President, Analog Por and Interface Biness Units from September 1999 to February 2019. Mr. Simoncic holds a B.S. degree in Electrical Engineering Technology from DeVry Institute of Technology.
Richard J. Simoncic, 自1999年9月起一直担任微芯科技公司的副总裁,负责模拟和接口产品部工作 。从1995年10月至1999年9月,他担任副总裁,负责了公司的各项工作。他于1990年加入公司,之后担任各种工作,包括设计、设备/收益工程和质量系统。他拥有德锐技术学院的电气工程技术学位。
Richard J. Simoncic has served as Chief Operating Officer of Microchip Technology Inc. (NASDAQ: MCHP) since April 1, 2024. Microchip is a leading provider of smart, connected and secure embedded control solutions. He served as Microchip's Executive Vice President Analog Por and Interface Biness Unit from April 2023 to April 2024; as Senior Vice President, Analog Por and Interface Biness Units from February 2019 to April 2023; and as Vice President, Analog Por and Interface Biness Units from September 1999 to February 2019. Mr. Simoncic holds a B.S. degree in Electrical Engineering Technology from DeVry Institute of Technology.