董事介绍

注:董事持股数取自最新公司公告

姓名 性别 职位 年龄 薪酬 持股数(万股) 截止日期
Victor Peng President and Chief Executive Officer and Director 61 1460.12万美元 19.15 2021-06-17
Dennis Segers Director,Chairman of the Board 68 43.14万美元 1.12 2021-06-17
Ronald S. Jankov Director 62 33.29万美元 1.30 2021-06-17
Saar Gillai Director 55 33.20万美元 0.96 2021-06-17
Thomas H. Lee Director 61 32.39万美元 0.81 2021-06-17
Mary Louise Krakauer Director 64 32.64万美元 0.71 2021-06-17
Raman K. Chitkara Director 62 未披露 未持股 2021-06-17
Raman K. Chitkara Director 62 34.64万美元 0.53 2021-06-17
Elizabeth W. Vanderslice Director 57 34.14万美元 3.70 2021-06-17
Jon A. Olson Director 67 31.64万美元 0.52 2021-06-17

高管介绍

注:高管持股数取自最新公司公告

姓名 性别 职位 年龄 薪酬 持股数(万股) 截止日期
Victor Peng President and Chief Executive Officer and Director 61 1460.12万美元 19.15 2021-06-17
William Madden Executive Vice President and General Manager, Wired and Wireless Group 62 487.72万美元 3.43 2021-06-17
Catia Hagopian Senior Vice President, General Counsel and Secretary 49 未披露 未持股 2021-06-17
Salil Raje Executive Vice President and General Manager, Data Center Group 51 488.62万美元 6.24 2021-06-17
Mark David Wadlington Senior Vice President, Core Markets Group 59 252.21万美元 未持股 2021-06-17
Brice Hill Executive Vice President and Chief Financial Officer 54 未披露 未持股 2021-06-17
Vamsi Boppana Senior Vice President, Central Products Group 48 408.59万美元 2.37 2021-06-17
Brice Hill Executive Vice President and Chief Financial Officer 55 650.18万美元 0.95 2021-06-17
Vincent L. Tong Executive Vice President, Global Operations and Quality 59 251.42万美元 未持股 2021-06-17

董事简历

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Victor Peng

Victor Peng, 2008年4月加入公司担任硅工程集团高级副总裁并在2008年11月成为可编程平台开发高级副总裁。加入公司之前,他从2005年11月到2008年4月担任高级微设备公司(一家处理方案供应商)图形产品集团副总裁。加入高级微设备公司之前他在半导体和处理行业公司担任多个行政管理职位。


Victor Peng retired in Augt 2024 from his position as President, Adaptive, Embedded, and AI Group, of Advanced Micro Devices, Inc. ("AMD"), a developer of leadership high performance and adaptive processor technologies, combining CP, GP, FPGAs, Adaptive SoCs and deep software expertise to enable leadership computing platforms for cloud, edge and end devices, a position he held since February 2022 when AMD acquired Xilinx, Inc. From January 2018 to February 2022, Mr. Peng served as President and Chief Executive Officer of Xilinx. He served on the Xilinx Board of Directors from October 2017 to February 2022. From April 2017 to January 2018, Mr. Peng served as Xilinx's Chief Operating Officer. From July 2014 to April 2017, he served as Executive Vice President and General Manager of Products. Prior to joining Xilinx, Mr. Peng served as Corporate Vice President, Graphics Products Group at AMD from November 2005 to April 2008. Prior to joining AMD, Mr. Peng served in a variety of executive engineering positions at companies in the semiconductor and processor indtries.
Victor Peng, 2008年4月加入公司担任硅工程集团高级副总裁并在2008年11月成为可编程平台开发高级副总裁。加入公司之前,他从2005年11月到2008年4月担任高级微设备公司(一家处理方案供应商)图形产品集团副总裁。加入高级微设备公司之前他在半导体和处理行业公司担任多个行政管理职位。
Victor Peng retired in Augt 2024 from his position as President, Adaptive, Embedded, and AI Group, of Advanced Micro Devices, Inc. ("AMD"), a developer of leadership high performance and adaptive processor technologies, combining CP, GP, FPGAs, Adaptive SoCs and deep software expertise to enable leadership computing platforms for cloud, edge and end devices, a position he held since February 2022 when AMD acquired Xilinx, Inc. From January 2018 to February 2022, Mr. Peng served as President and Chief Executive Officer of Xilinx. He served on the Xilinx Board of Directors from October 2017 to February 2022. From April 2017 to January 2018, Mr. Peng served as Xilinx's Chief Operating Officer. From July 2014 to April 2017, he served as Executive Vice President and General Manager of Products. Prior to joining Xilinx, Mr. Peng served as Corporate Vice President, Graphics Products Group at AMD from November 2005 to April 2008. Prior to joining AMD, Mr. Peng served in a variety of executive engineering positions at companies in the semiconductor and processor indtries.
Dennis Segers

Dennis Segers,2015年10月加入本公司董事会,2015年11月被提名为董事会主席。他给许多高科技市场的公司担任技术顾问和战略顾问。Segers先生目前任职于上市生产线半导体公司Parade Technologies, Ltd.董事会。此前,他是Tabula, Inc.(创新的可编程序逻辑解决方案提供商,提供具有突破能力挑战性的系统应用)的首席执行官。在Tabula之前,他在Matrix Semiconductor(三维集成电路的先锋,历史上第一个半导体技术)担任总裁,首席执行官和董事。在Matrix,Segers先生监督从技术可行性阶段到早期大量生产交易,最终在2006年1月收购SanDisk 。1994-2001年,Segers先生工作于Xilinx,担任多个领导职位,包括FPGA产品组总经理,高级副总裁。


Dennis Segers,joined the Board in October 2015 and was named Chairman of the Board in November 2015. He works as a technology consultant and strategy advisor to companies in a variety of technology markets. Mr. Segers currently also serves on the board of Parade Technologies, Ltd., a publicly-traded fabless semiconductor company. Previously, he was CEO of Tabula, Inc., an innovative programmable logic solutions provider, delivering breakthrough capabilities for challenging systems applications. Prior to Tabula, he served as president, CEO and a director of Matrix Semiconductor, a pioneer of three-dimensional integrated circuits, a first in the history of semiconductor technology. At Matrix, Mr. Segers oversaw the transition of the company from the early technology feasibility phase to high volume production, culminating in the acquisition of the company by SanDisk in January 2006. From 1994 through 2001, Mr. Segers was an employee of Xilinx, serving in a variety of leadership roles including Senior Vice President and General Manager of the FPGA product groups. Mr. Segers also serves on the board of AnDAPT, Inc., a privately-held developer of on-demand power management solutions.
Dennis Segers,2015年10月加入本公司董事会,2015年11月被提名为董事会主席。他给许多高科技市场的公司担任技术顾问和战略顾问。Segers先生目前任职于上市生产线半导体公司Parade Technologies, Ltd.董事会。此前,他是Tabula, Inc.(创新的可编程序逻辑解决方案提供商,提供具有突破能力挑战性的系统应用)的首席执行官。在Tabula之前,他在Matrix Semiconductor(三维集成电路的先锋,历史上第一个半导体技术)担任总裁,首席执行官和董事。在Matrix,Segers先生监督从技术可行性阶段到早期大量生产交易,最终在2006年1月收购SanDisk 。1994-2001年,Segers先生工作于Xilinx,担任多个领导职位,包括FPGA产品组总经理,高级副总裁。
Dennis Segers,joined the Board in October 2015 and was named Chairman of the Board in November 2015. He works as a technology consultant and strategy advisor to companies in a variety of technology markets. Mr. Segers currently also serves on the board of Parade Technologies, Ltd., a publicly-traded fabless semiconductor company. Previously, he was CEO of Tabula, Inc., an innovative programmable logic solutions provider, delivering breakthrough capabilities for challenging systems applications. Prior to Tabula, he served as president, CEO and a director of Matrix Semiconductor, a pioneer of three-dimensional integrated circuits, a first in the history of semiconductor technology. At Matrix, Mr. Segers oversaw the transition of the company from the early technology feasibility phase to high volume production, culminating in the acquisition of the company by SanDisk in January 2006. From 1994 through 2001, Mr. Segers was an employee of Xilinx, serving in a variety of leadership roles including Senior Vice President and General Manager of the FPGA product groups. Mr. Segers also serves on the board of AnDAPT, Inc., a privately-held developer of on-demand power management solutions.
Ronald S. Jankov

Ronald S. Jankov,他于2016年3月加入公司的董事会。他是GlobalLink1 Capital(2014年他创立的一个投资公司)的首席执行官。从2012年到2014年,他曾担任Broadcom Corporation的高级副总裁兼总经理,负责处理器和无线基础设施。从2000年到2012年,他担任NetLogic Microsystems, Inc.(一家专业的半导体网络应用程序供应商)总裁和首席执行官。他担任其董事。在他的领导下,NetLogic从初创公司增长通过首次公开募股(Initial Public Offerings)到网络处理设备的营销领导,最终公司以37亿美元的价格被Broadcom收购。他也担任NeoMagic Corporation(一个专业的半导体公司)、Cyrix Corporation(微处理器的开发人员)和Accell Technology(他创立的一个半导体公司被Cyrix收购)的执行管理职务。他担任LSI Logic的高级管理职务。他的事业始于Texas Instruments Inc.。他担任Knowles Corporation和几个私人公司的董事会职务。


Ronald S. Jankov,joined the Board in May 2016. He is Chief Executive Officer of GlobalLink1 Capital, an investment firm he founded in 2014. From 2012 to 2014, Mr. Jankov served as Senior Vice President and General Manager of Processors and Wireless Infrastructure for Broadcom Corporation. From 2000 to 2012, Mr. Jankov was President and Chief Executive Officer and a director of NetLogic Microsystems, Inc., a fabless provider of semiconductors for networking applications. Under Mr. Jankov's leadership, NetLogic grew from start-up, through an IPO to market leadership in network processing devices, culminating in the company's acquisition by Broadcom for $3.7 billion. Mr. Jankov has also held executive management positions with NeoMagic Corporation, a fabless semiconductor company, Cyrix Corporation, a developer of microprocessors, and Accell Technology, a semiconductor company he founded that was later acquired by Cyrix. Mr. Jankov also served in senior management at LSI Logic and began his career at Texas Instruments Inc. Mr. Jankov serves on the board of Knowles Corporation as well as several private companies.
Ronald S. Jankov,他于2016年3月加入公司的董事会。他是GlobalLink1 Capital(2014年他创立的一个投资公司)的首席执行官。从2012年到2014年,他曾担任Broadcom Corporation的高级副总裁兼总经理,负责处理器和无线基础设施。从2000年到2012年,他担任NetLogic Microsystems, Inc.(一家专业的半导体网络应用程序供应商)总裁和首席执行官。他担任其董事。在他的领导下,NetLogic从初创公司增长通过首次公开募股(Initial Public Offerings)到网络处理设备的营销领导,最终公司以37亿美元的价格被Broadcom收购。他也担任NeoMagic Corporation(一个专业的半导体公司)、Cyrix Corporation(微处理器的开发人员)和Accell Technology(他创立的一个半导体公司被Cyrix收购)的执行管理职务。他担任LSI Logic的高级管理职务。他的事业始于Texas Instruments Inc.。他担任Knowles Corporation和几个私人公司的董事会职务。
Ronald S. Jankov,joined the Board in May 2016. He is Chief Executive Officer of GlobalLink1 Capital, an investment firm he founded in 2014. From 2012 to 2014, Mr. Jankov served as Senior Vice President and General Manager of Processors and Wireless Infrastructure for Broadcom Corporation. From 2000 to 2012, Mr. Jankov was President and Chief Executive Officer and a director of NetLogic Microsystems, Inc., a fabless provider of semiconductors for networking applications. Under Mr. Jankov's leadership, NetLogic grew from start-up, through an IPO to market leadership in network processing devices, culminating in the company's acquisition by Broadcom for $3.7 billion. Mr. Jankov has also held executive management positions with NeoMagic Corporation, a fabless semiconductor company, Cyrix Corporation, a developer of microprocessors, and Accell Technology, a semiconductor company he founded that was later acquired by Cyrix. Mr. Jankov also served in senior management at LSI Logic and began his career at Texas Instruments Inc. Mr. Jankov serves on the board of Knowles Corporation as well as several private companies.
Saar Gillai

Saar Gillai。2016年5月,加入本公司董事局。自2015年9月起,Gillai先生担任惠普企业通信解决方案业务中心总经理和高级副总裁。2012年10月-2015年9月,Gillai先生担任高级副总裁,总经理,惠普云业务首席运营官。2010年5月-2012年10月,Gillai先生担任高级技术部门副总裁,惠普网络首席技术管。加入惠普之前,Gillai先生担任3Com公司全球产品和解决方案高级副总裁,该公司于2010年被惠普收购。 Gillai先生也曾在无线网产品供应商Tropos网络有限公司担任高级管理职位,在无线机器对机器(M2M)Enfora有限公司担任产品发展和运营的高级管理职位。此外,Gillai先生曾在思科系统公司有过7年多种管理职位经理,包括四颗无线网络业务工程的副总裁。


Saar Gillai,joined the Board in May 2016. Mr. Gillai serves as the Chief Executive Officer of Teridion Inc., a cloud routing optimization company, a position he has held since October 2017. From September 2015 until November 2016, he served as Senior Vice President and General Manager of Hewlett-Packard Enterprise's Communications Solutions Business. From October 2012 until September 2015, Mr. Gillai served as Senior Vice President, General Manager and Chief Operating Officer of the Cloud business of Hewlett-Packard Company (HP). From May 2010 until October 2012, Mr. Gillai served as Vice President, Advanced Technology Group and Chief Technology Officer of HP Networking. Prior to HP, Mr. Gillai was Senior Vice President of Worldwide Products and Solutions for 3Com Corporation, which was acquired by HP in 2010. Mr. Gillai also has held senior management positions in engineering with Tropos Networks Inc., a provider of wireless mesh products and senior management positions in product development and operations with Enfora, Inc., a wireless machine-to-machine (M2M) company. In addition, Mr. Gillai served for seven years in a variety of leadership positions with Cisco Systems, Inc., including as Vice President of Engineering for Cisco's Wireless Networking business unit. Mr. Gillai also serves on the boards of Semtech Corporation, a supplier of analog and mixed-signal semiconductors, and SpaceIQ, a privately-held provider of a cloud-based workplace management platform.
Saar Gillai。2016年5月,加入本公司董事局。自2015年9月起,Gillai先生担任惠普企业通信解决方案业务中心总经理和高级副总裁。2012年10月-2015年9月,Gillai先生担任高级副总裁,总经理,惠普云业务首席运营官。2010年5月-2012年10月,Gillai先生担任高级技术部门副总裁,惠普网络首席技术管。加入惠普之前,Gillai先生担任3Com公司全球产品和解决方案高级副总裁,该公司于2010年被惠普收购。 Gillai先生也曾在无线网产品供应商Tropos网络有限公司担任高级管理职位,在无线机器对机器(M2M)Enfora有限公司担任产品发展和运营的高级管理职位。此外,Gillai先生曾在思科系统公司有过7年多种管理职位经理,包括四颗无线网络业务工程的副总裁。
Saar Gillai,joined the Board in May 2016. Mr. Gillai serves as the Chief Executive Officer of Teridion Inc., a cloud routing optimization company, a position he has held since October 2017. From September 2015 until November 2016, he served as Senior Vice President and General Manager of Hewlett-Packard Enterprise's Communications Solutions Business. From October 2012 until September 2015, Mr. Gillai served as Senior Vice President, General Manager and Chief Operating Officer of the Cloud business of Hewlett-Packard Company (HP). From May 2010 until October 2012, Mr. Gillai served as Vice President, Advanced Technology Group and Chief Technology Officer of HP Networking. Prior to HP, Mr. Gillai was Senior Vice President of Worldwide Products and Solutions for 3Com Corporation, which was acquired by HP in 2010. Mr. Gillai also has held senior management positions in engineering with Tropos Networks Inc., a provider of wireless mesh products and senior management positions in product development and operations with Enfora, Inc., a wireless machine-to-machine (M2M) company. In addition, Mr. Gillai served for seven years in a variety of leadership positions with Cisco Systems, Inc., including as Vice President of Engineering for Cisco's Wireless Networking business unit. Mr. Gillai also serves on the boards of Semtech Corporation, a supplier of analog and mixed-signal semiconductors, and SpaceIQ, a privately-held provider of a cloud-based workplace management platform.
Thomas H. Lee

Thomas H. Lee,2016年5月他加入公司。他是Stanford University的电气工程教授。1994年他加入Stanford并担任教职员工。他创立the Stanford Microwave Integrated Circuits Laboratory。从2011年4月到2012年10月,他担任the Defense Advanced Research Projects Agency (DARPA)的the Microsystems Technology Office的董事。他也联合创办3个初创公司:Matrix Semiconductor, Inc. (被SanDisk收购)、ZeroG Wireless (被Microchip Technology收购)和Ayla Networks。他获得the Massachusetts Institute of Technology的电子工程学士、硕士和博士学位。他编著和联合编著了许多书籍和论文,并在高性能模拟电路设计和无线通信技术方面被广泛认可。他是the Institute of Electrical and Electronics Engineers饿研究员并且是许多荣誉和奖项的获得者,包括the United States Secretary of Defense Medal for Exceptional Civilian Service(由于他在DARPA的服务)。他也获得the 2011 Ho-Am Prize in Engineering。他拥有66个专利。


Thomas H. Lee,joined the Board in May 2016. Dr. Lee is a Professor of Electrical Engineering at Stanford University. He joined the Stanford faculty in 1994 and founded the Stanford Microwave Integrated Circuits Laboratory. From April 2011 through October 2012, he served as the Director of the Microsystems Technology Office at the Defense Advanced Research Projects Agency (DARPA). He has also co-founded three startups: Matrix Semiconductor, Inc. (acquired by SanDisk), ZeroG Wireless (acquired by Microchip Technology) and Ayla Networks. Dr. Lee received his S.B., S.M. and doctorate of Electrical Engineering from the Massachusetts Institute of Technology. He has written and co-authored numerous books and papers and is widely recognized for his expertise in high performance analog circuit designs and wireless communications technology. He is a Fellow of the Institute of Electrical and Electronics Engineers and has been the recipient of many honors and awards including the United States Secretary of Defense Medal for Exceptional Civilian Service for his service at DARPA. He was also awarded the 2011 Ho-Am Prize in Engineering. He has been granted 65 patents. Dr. Lee also serves on the board of directors of Humatics Corporation, a privately-held company focusing on microlocation technology.
Thomas H. Lee,2016年5月他加入公司。他是Stanford University的电气工程教授。1994年他加入Stanford并担任教职员工。他创立the Stanford Microwave Integrated Circuits Laboratory。从2011年4月到2012年10月,他担任the Defense Advanced Research Projects Agency (DARPA)的the Microsystems Technology Office的董事。他也联合创办3个初创公司:Matrix Semiconductor, Inc. (被SanDisk收购)、ZeroG Wireless (被Microchip Technology收购)和Ayla Networks。他获得the Massachusetts Institute of Technology的电子工程学士、硕士和博士学位。他编著和联合编著了许多书籍和论文,并在高性能模拟电路设计和无线通信技术方面被广泛认可。他是the Institute of Electrical and Electronics Engineers饿研究员并且是许多荣誉和奖项的获得者,包括the United States Secretary of Defense Medal for Exceptional Civilian Service(由于他在DARPA的服务)。他也获得the 2011 Ho-Am Prize in Engineering。他拥有66个专利。
Thomas H. Lee,joined the Board in May 2016. Dr. Lee is a Professor of Electrical Engineering at Stanford University. He joined the Stanford faculty in 1994 and founded the Stanford Microwave Integrated Circuits Laboratory. From April 2011 through October 2012, he served as the Director of the Microsystems Technology Office at the Defense Advanced Research Projects Agency (DARPA). He has also co-founded three startups: Matrix Semiconductor, Inc. (acquired by SanDisk), ZeroG Wireless (acquired by Microchip Technology) and Ayla Networks. Dr. Lee received his S.B., S.M. and doctorate of Electrical Engineering from the Massachusetts Institute of Technology. He has written and co-authored numerous books and papers and is widely recognized for his expertise in high performance analog circuit designs and wireless communications technology. He is a Fellow of the Institute of Electrical and Electronics Engineers and has been the recipient of many honors and awards including the United States Secretary of Defense Medal for Exceptional Civilian Service for his service at DARPA. He was also awarded the 2011 Ho-Am Prize in Engineering. He has been granted 65 patents. Dr. Lee also serves on the board of directors of Humatics Corporation, a privately-held company focusing on microlocation technology.
Mary Louise Krakauer

Mary Louise Krakauer,自2022年1月起担任Proterra Inc.董事会成员。她还曾担任Mercury Systems, Inc.(2017年7月以来),Cadence Design Systems, Inc.(2022年1月以来),Xilinx, Inc.(2017年11月至2022年2月)被AMD, Inc.收购,DXC Technology Co.(2018年3月至2022年7月)的董事会成员。Krakauer女士曾担任Dell Corporation(一家美国技术公司)的执行副总裁兼首席信息官,该公司于2016年9月被Dell收购EMC Corporation(一家数据存储和数据管理技术公司),直到她于2017年1月退休,在那里她负责全球IT,包括所有运营和整合活动。2016年1月至9月,她担任EMC Corporation的首席信息官和全球商业服务执行副总裁。在此之前,她于2015年6月至12月担任EMC Corporation全球企业服务业务发展执行副总裁,并于2012年至2015年6月担任EMC Corporation全球人力资源执行副总裁,负责执行,领导和员工发展,薪酬和福利,人员配置以及收购整合的所有人员相关方面。她还曾担任EMC Corporation、Hewlett-Packard Co.、Compaq Computer Co.和Digital Equipment Co.的其他行政业务领导职务。她拥有普林斯顿大学的工程学士学位和哈佛商学院的工商管理硕士学位。


Mary Louise Krakauer,has served as Board Chair since 2023 and as a director of Cadence since 2022. Ms. Krakauer retired as Executive Vice President, Chief Information Officer of Dell Corporation, a global information technology company, in 2017. Prior to that, she held multiple executive positions at EMC Corporation, a global IT infrastructure company, which she joined in 2008. These included Executive Vice President, Chief Information Officer; Executive Vice President, Business Development, Global Enterprise Services; Executive Vice President, Global Human Resources; and VP and COO, Technology Services & Solutions and Managed Services Businesses. Prior to joining EMC, Ms. Krakauer held executive general management roles at Hewlett-Packard Enterprise, Compaq Computer Corporation and Digital Equipment Corporation.Ms. Krakauer served as a director of Proterra Inc. from 2022 to 2024, Mercury Systems, Inc. from 2017 to 2023, DXC Technology Company from 2018 to 2022 and Xilinx, Inc. from 2017 to 2022.
Mary Louise Krakauer,自2022年1月起担任Proterra Inc.董事会成员。她还曾担任Mercury Systems, Inc.(2017年7月以来),Cadence Design Systems, Inc.(2022年1月以来),Xilinx, Inc.(2017年11月至2022年2月)被AMD, Inc.收购,DXC Technology Co.(2018年3月至2022年7月)的董事会成员。Krakauer女士曾担任Dell Corporation(一家美国技术公司)的执行副总裁兼首席信息官,该公司于2016年9月被Dell收购EMC Corporation(一家数据存储和数据管理技术公司),直到她于2017年1月退休,在那里她负责全球IT,包括所有运营和整合活动。2016年1月至9月,她担任EMC Corporation的首席信息官和全球商业服务执行副总裁。在此之前,她于2015年6月至12月担任EMC Corporation全球企业服务业务发展执行副总裁,并于2012年至2015年6月担任EMC Corporation全球人力资源执行副总裁,负责执行,领导和员工发展,薪酬和福利,人员配置以及收购整合的所有人员相关方面。她还曾担任EMC Corporation、Hewlett-Packard Co.、Compaq Computer Co.和Digital Equipment Co.的其他行政业务领导职务。她拥有普林斯顿大学的工程学士学位和哈佛商学院的工商管理硕士学位。
Mary Louise Krakauer,has served as Board Chair since 2023 and as a director of Cadence since 2022. Ms. Krakauer retired as Executive Vice President, Chief Information Officer of Dell Corporation, a global information technology company, in 2017. Prior to that, she held multiple executive positions at EMC Corporation, a global IT infrastructure company, which she joined in 2008. These included Executive Vice President, Chief Information Officer; Executive Vice President, Business Development, Global Enterprise Services; Executive Vice President, Global Human Resources; and VP and COO, Technology Services & Solutions and Managed Services Businesses. Prior to joining EMC, Ms. Krakauer held executive general management roles at Hewlett-Packard Enterprise, Compaq Computer Corporation and Digital Equipment Corporation.Ms. Krakauer served as a director of Proterra Inc. from 2022 to 2024, Mercury Systems, Inc. from 2017 to 2023, DXC Technology Company from 2018 to 2022 and Xilinx, Inc. from 2017 to 2022.
Raman K. Chitkara

Raman K. Chitkara于2018年8月加入董事会。从1984年到2018年6月退休,Chitkara先生在普华永道会计师事务所(PricewaterhouseCoopers LLP PwC)工作,担任普华永道会计师事务所的全球技术行业领导者,此前曾担任普华永道的全球半导体行业领导者。在普华永道任职期间,他还担任了多个领导职位,包括审计质量委员会成员和全球保证TICE(技术、信息、通信、娱乐和媒体)业务主管。奇卡拉先生也在SiTime公司董事会任职,SiTime公司是一家硅计时解决方案供应商。


Raman K. Chitkara joined the Board in August 2018. From 1984 until his retirement in June 2018 Mr. Chitkara worked at PricewaterhouseCoopers LLP PwC, a public accounting firm, where he served as its Global Technology Industry Leader and previously served as the firm’s Global Semiconductor Industry Leader. During his tenure at PwC, he held a number of additional leadership positions, including membership of the Audit Quality Board and Leader of the Global Assurance TICE (Technology, Information, Communication, Entertainment and Media) Practice. Mr. Chitkara also serves on the boards of SiTime Corporation, a supplier of silicon timing solutions, and several private companies. Mr. Chitkara’s qualifications to serve on the Board include his extensive experience with public and financial accounting matters for complex global organizations. His financial experience enables Mr. Chitkara to contribute meaningfully to the Board’s role in the oversight of our financial reporting, accounting and executive compensation practices.
Raman K. Chitkara于2018年8月加入董事会。从1984年到2018年6月退休,Chitkara先生在普华永道会计师事务所(PricewaterhouseCoopers LLP PwC)工作,担任普华永道会计师事务所的全球技术行业领导者,此前曾担任普华永道的全球半导体行业领导者。在普华永道任职期间,他还担任了多个领导职位,包括审计质量委员会成员和全球保证TICE(技术、信息、通信、娱乐和媒体)业务主管。奇卡拉先生也在SiTime公司董事会任职,SiTime公司是一家硅计时解决方案供应商。
Raman K. Chitkara joined the Board in August 2018. From 1984 until his retirement in June 2018 Mr. Chitkara worked at PricewaterhouseCoopers LLP PwC, a public accounting firm, where he served as its Global Technology Industry Leader and previously served as the firm’s Global Semiconductor Industry Leader. During his tenure at PwC, he held a number of additional leadership positions, including membership of the Audit Quality Board and Leader of the Global Assurance TICE (Technology, Information, Communication, Entertainment and Media) Practice. Mr. Chitkara also serves on the boards of SiTime Corporation, a supplier of silicon timing solutions, and several private companies. Mr. Chitkara’s qualifications to serve on the Board include his extensive experience with public and financial accounting matters for complex global organizations. His financial experience enables Mr. Chitkara to contribute meaningfully to the Board’s role in the oversight of our financial reporting, accounting and executive compensation practices.
Raman K. Chitkara

Raman K. Chitkara于2018年8月加入董事会。从1984年到2018年6月退休,Chitkara先生在普华永道会计师事务所(PricewaterhouseCoopers LLP PwC)工作,担任普华永道会计师事务所的全球技术行业领导者,此前曾担任普华永道的全球半导体行业领导者。在普华永道任职期间,他还担任了多个领导职位,包括审计质量委员会成员和全球保证TICE(技术、信息、通信、娱乐和媒体)业务主管。Chitkara先生也在SiTime公司董事会任职,SiTime公司是一家硅计时解决方案供应商。


Raman K. Chitkara,has served as a member of Board since November 2019, and as lead independent director of Board since January 2020. Since January 2021, Mr. Chitkara has served as a board member and chair of the audit committee of Arteris, Inc., a provider of interconnect and other intellectual property technology. Since March 2021, Mr. Chitkara has served as a board member of Automation Anywhere, Inc., an intelligent automation platform provider. From September 1984 to June 2018, Mr. Chitkara worked at PricewaterhouseCoopers LLP ("PwC"), a public accounting firm, where he served in various capacities including as partner, global technology industry leader, and global semiconductor industry leader. During his tenure at PwC, Mr. Chitkara held numerous leadership positions, including membership of the audit quality board and leader of the global assurance technology, information, communication, entertainment, and media practice. Mr. Chitkara served as a board member and chair of the audit committee of Xilinx, Inc., a technology and programmable logic device company, from August 2018 to February 2022. Mr. Chitkara holds a Bachelor of Commerce in accounting and business management from Shri Ram College of Commerce.
Raman K. Chitkara于2018年8月加入董事会。从1984年到2018年6月退休,Chitkara先生在普华永道会计师事务所(PricewaterhouseCoopers LLP PwC)工作,担任普华永道会计师事务所的全球技术行业领导者,此前曾担任普华永道的全球半导体行业领导者。在普华永道任职期间,他还担任了多个领导职位,包括审计质量委员会成员和全球保证TICE(技术、信息、通信、娱乐和媒体)业务主管。Chitkara先生也在SiTime公司董事会任职,SiTime公司是一家硅计时解决方案供应商。
Raman K. Chitkara,has served as a member of Board since November 2019, and as lead independent director of Board since January 2020. Since January 2021, Mr. Chitkara has served as a board member and chair of the audit committee of Arteris, Inc., a provider of interconnect and other intellectual property technology. Since March 2021, Mr. Chitkara has served as a board member of Automation Anywhere, Inc., an intelligent automation platform provider. From September 1984 to June 2018, Mr. Chitkara worked at PricewaterhouseCoopers LLP ("PwC"), a public accounting firm, where he served in various capacities including as partner, global technology industry leader, and global semiconductor industry leader. During his tenure at PwC, Mr. Chitkara held numerous leadership positions, including membership of the audit quality board and leader of the global assurance technology, information, communication, entertainment, and media practice. Mr. Chitkara served as a board member and chair of the audit committee of Xilinx, Inc., a technology and programmable logic device company, from August 2018 to February 2022. Mr. Chitkara holds a Bachelor of Commerce in accounting and business management from Shri Ram College of Commerce.
Elizabeth W. Vanderslice

Elizabeth W. Vanderslice, 2000年12月加入公司董事会。从1999年7月到2001年7月担任Terra莱科思有限公司(互联网接入和交互式内容提供商)总经理。 加入Terra莱科思有限公司之前,她从1995年开始担任有线数字公司(一家网络服务公司)副总裁;从1996年到1999年6月开始担任总裁和首席执行官,领导了Terra莱科思有限公司的收购工作。加入有限数字公司之前,她在1994年成为英镑柏姿公司投资银行律所主要负责人并成为H. W。杰西公司(旧金山投资银行业务和商业战略咨询公司,英镑柏姿公司的一个分公司)副总裁。她持有哈佛商学院硕士学位而且是波士顿大学信托董事会成员。


Elizabeth W. Vanderslice,has served as a partner at Trewstar Corporate Board Services, a firm specializing in corporate board placements, since February 2019. She served on the board of Xilinx, Inc. from December 2000 through its acquisition by AMD in February 2022. Ms. Vanderslice also serves on the boards of AESC Group Ltd. and Univers Holdings, both private companies. From 1999 to 2001, Ms. Vanderslice served as a general manager of Lycos, Inc. (Lycos) through its acquisition. From 1996 to 1999, Ms. Vanderslice was CEO of Wired Digital, Inc. (Wired Digital), a spin-off of Wired Ventures, Inc. (Wired Ventures), and a member of the boards of both Wired Digital and Wired Ventures before leading the company's acquisition by Lycos. Prior to joining Wired Digital in early 1995, Ms. Vanderslice served as a principal in the investment banking firm Sterling Payot Company, which raised the capital to launch Wired Magazine. She was also a Vice President at H.W. Jesse & Co. (a San Francisco investment banking firm). In addition, she worked for the IBM Corporation from 1986-1990. Ms. Vanderslice holds a Master of Business Administration from the Harvard Business School and a Bachelor of Science degree in computer science from Boston College. She is an Aspen Institute Henry Crown Fellow and was a member of the Young Presidents' Organization and the World Presidents' Organization. Ms. Vanderslice has also served as a Trustee of Boston College since 2010.
Elizabeth W. Vanderslice, 2000年12月加入公司董事会。从1999年7月到2001年7月担任Terra莱科思有限公司(互联网接入和交互式内容提供商)总经理。 加入Terra莱科思有限公司之前,她从1995年开始担任有线数字公司(一家网络服务公司)副总裁;从1996年到1999年6月开始担任总裁和首席执行官,领导了Terra莱科思有限公司的收购工作。加入有限数字公司之前,她在1994年成为英镑柏姿公司投资银行律所主要负责人并成为H. W。杰西公司(旧金山投资银行业务和商业战略咨询公司,英镑柏姿公司的一个分公司)副总裁。她持有哈佛商学院硕士学位而且是波士顿大学信托董事会成员。
Elizabeth W. Vanderslice,has served as a partner at Trewstar Corporate Board Services, a firm specializing in corporate board placements, since February 2019. She served on the board of Xilinx, Inc. from December 2000 through its acquisition by AMD in February 2022. Ms. Vanderslice also serves on the boards of AESC Group Ltd. and Univers Holdings, both private companies. From 1999 to 2001, Ms. Vanderslice served as a general manager of Lycos, Inc. (Lycos) through its acquisition. From 1996 to 1999, Ms. Vanderslice was CEO of Wired Digital, Inc. (Wired Digital), a spin-off of Wired Ventures, Inc. (Wired Ventures), and a member of the boards of both Wired Digital and Wired Ventures before leading the company's acquisition by Lycos. Prior to joining Wired Digital in early 1995, Ms. Vanderslice served as a principal in the investment banking firm Sterling Payot Company, which raised the capital to launch Wired Magazine. She was also a Vice President at H.W. Jesse & Co. (a San Francisco investment banking firm). In addition, she worked for the IBM Corporation from 1986-1990. Ms. Vanderslice holds a Master of Business Administration from the Harvard Business School and a Bachelor of Science degree in computer science from Boston College. She is an Aspen Institute Henry Crown Fellow and was a member of the Young Presidents' Organization and the World Presidents' Organization. Ms. Vanderslice has also served as a Trustee of Boston College since 2010.
Jon A. Olson

Jon A. Olson, 自2011年10月担任公司董事。自2006年8月起担任Xilinx有限公司(可编程半导体平台的提供者)财务高级副总裁和首席财务官;2005年6月加入Xilinx担任金融副总裁和首席财务官。加入Xilinx之前,他从1979年到2005年担任英特尔公司(半导体芯片制造商)多个高级金融职位,包括金融和企业服务副总裁、金融主管。他持有圣克拉拉大学金融硕士学位以及印第安纳大学会计学士学位。


Jon A. Olson,was appointed to the board of directors on March 5, 2021. He most recently served as Chief Financial Officer of Xilinx, Inc., where his responsibilities covered finance, IT, purchasing, and facilities from 2005 through his retirement in 2016. Prior to joining Xilinx, Mr. Olson spent over 25 years at Intel Corporation where, as Director of Finance, he was responsible for the finance function of all business units, factories and administrative support company-wide. Mr. Olson currently serves as Director on the Board of Advanced Micro Devices, Inc. (NASDAQ: AMD), and as Director and Audit Committee Chair of Rocket Lab USA, Inc (NASDAQ: RKLB). He previously served as Director and Audit Committee Chair of Mellanox Technologies, InvenSense, Inc. and Home Union, Inc., and as Director of Xilinx, Inc. Mr. Olson is also a Member of the Deans Advisory Council and was inducted into the Academy of Alumni Fellows of the Kelley School of Business, Indiana University. In 2010, Mr. Olson was recognized as CFO of the Year by Silicon Valley Business Journal. Mr. Olson holds a Bachelor of Science in Accounting from Indiana University and a Masters of Business Administration from Santa Clara University.
Jon A. Olson, 自2011年10月担任公司董事。自2006年8月起担任Xilinx有限公司(可编程半导体平台的提供者)财务高级副总裁和首席财务官;2005年6月加入Xilinx担任金融副总裁和首席财务官。加入Xilinx之前,他从1979年到2005年担任英特尔公司(半导体芯片制造商)多个高级金融职位,包括金融和企业服务副总裁、金融主管。他持有圣克拉拉大学金融硕士学位以及印第安纳大学会计学士学位。
Jon A. Olson,was appointed to the board of directors on March 5, 2021. He most recently served as Chief Financial Officer of Xilinx, Inc., where his responsibilities covered finance, IT, purchasing, and facilities from 2005 through his retirement in 2016. Prior to joining Xilinx, Mr. Olson spent over 25 years at Intel Corporation where, as Director of Finance, he was responsible for the finance function of all business units, factories and administrative support company-wide. Mr. Olson currently serves as Director on the Board of Advanced Micro Devices, Inc. (NASDAQ: AMD), and as Director and Audit Committee Chair of Rocket Lab USA, Inc (NASDAQ: RKLB). He previously served as Director and Audit Committee Chair of Mellanox Technologies, InvenSense, Inc. and Home Union, Inc., and as Director of Xilinx, Inc. Mr. Olson is also a Member of the Deans Advisory Council and was inducted into the Academy of Alumni Fellows of the Kelley School of Business, Indiana University. In 2010, Mr. Olson was recognized as CFO of the Year by Silicon Valley Business Journal. Mr. Olson holds a Bachelor of Science in Accounting from Indiana University and a Masters of Business Administration from Santa Clara University.

高管简历

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Victor Peng

Victor Peng, 2008年4月加入公司担任硅工程集团高级副总裁并在2008年11月成为可编程平台开发高级副总裁。加入公司之前,他从2005年11月到2008年4月担任高级微设备公司(一家处理方案供应商)图形产品集团副总裁。加入高级微设备公司之前他在半导体和处理行业公司担任多个行政管理职位。


Victor Peng retired in Augt 2024 from his position as President, Adaptive, Embedded, and AI Group, of Advanced Micro Devices, Inc. ("AMD"), a developer of leadership high performance and adaptive processor technologies, combining CP, GP, FPGAs, Adaptive SoCs and deep software expertise to enable leadership computing platforms for cloud, edge and end devices, a position he held since February 2022 when AMD acquired Xilinx, Inc. From January 2018 to February 2022, Mr. Peng served as President and Chief Executive Officer of Xilinx. He served on the Xilinx Board of Directors from October 2017 to February 2022. From April 2017 to January 2018, Mr. Peng served as Xilinx's Chief Operating Officer. From July 2014 to April 2017, he served as Executive Vice President and General Manager of Products. Prior to joining Xilinx, Mr. Peng served as Corporate Vice President, Graphics Products Group at AMD from November 2005 to April 2008. Prior to joining AMD, Mr. Peng served in a variety of executive engineering positions at companies in the semiconductor and processor indtries.
Victor Peng, 2008年4月加入公司担任硅工程集团高级副总裁并在2008年11月成为可编程平台开发高级副总裁。加入公司之前,他从2005年11月到2008年4月担任高级微设备公司(一家处理方案供应商)图形产品集团副总裁。加入高级微设备公司之前他在半导体和处理行业公司担任多个行政管理职位。
Victor Peng retired in Augt 2024 from his position as President, Adaptive, Embedded, and AI Group, of Advanced Micro Devices, Inc. ("AMD"), a developer of leadership high performance and adaptive processor technologies, combining CP, GP, FPGAs, Adaptive SoCs and deep software expertise to enable leadership computing platforms for cloud, edge and end devices, a position he held since February 2022 when AMD acquired Xilinx, Inc. From January 2018 to February 2022, Mr. Peng served as President and Chief Executive Officer of Xilinx. He served on the Xilinx Board of Directors from October 2017 to February 2022. From April 2017 to January 2018, Mr. Peng served as Xilinx's Chief Operating Officer. From July 2014 to April 2017, he served as Executive Vice President and General Manager of Products. Prior to joining Xilinx, Mr. Peng served as Corporate Vice President, Graphics Products Group at AMD from November 2005 to April 2008. Prior to joining AMD, Mr. Peng served in a variety of executive engineering positions at companies in the semiconductor and processor indtries.
William Madden

William Madden于2008年5月加入公司,目前担任有线和无线集团执行副总裁兼总经理,自2019年4月起担任该职位。2018年6月至2019年3月,他担任硬件和系统产品开发执行副总裁。2017年7月至2018年5月,他担任硬件和系统产品开发高级副总裁。2010年10月至2017年6月,Madden先生担任公司副总裁,负责FPGA开发和硅技术。2008年5月至2010年9月,马登先生担任硅技术公司副总裁。在加入该公司之前,马登曾在AMD担任高级研究员,负责推动AMD的下一代芯片集成方法。马登先生还是爱尔兰工程师学会的研究员和爱尔兰科学基金会的董事会成员。


William Madden joined the Company in May 2008 and currently serves as Executive Vice President and General Manager, Wired and Wireless Group, a position he has held since April 2019. From June 2018 to March 2019 he served as Executive Vice President, Hardware and Systems Product Development. From July 2017 to May 2018 he served as Senior Vice President, Hardware and Systems Product Development. From October 2010 to June 2017,Mr. Madden served as Corporate Vice President, FPGA Development and Silicon Technology. From May 2008 to September 2010,Mr. Madden served as Vice President of Silicon Technology. Prior to joining the Company, Mr. Madden served as a Senior Fellow at AMD where he drove AMD's next generation chip integration methodology. Mr. Madden is also a Fellow of the Institute of Engineers Ireland and a Board Member of Science Foundation Ireland.
William Madden于2008年5月加入公司,目前担任有线和无线集团执行副总裁兼总经理,自2019年4月起担任该职位。2018年6月至2019年3月,他担任硬件和系统产品开发执行副总裁。2017年7月至2018年5月,他担任硬件和系统产品开发高级副总裁。2010年10月至2017年6月,Madden先生担任公司副总裁,负责FPGA开发和硅技术。2008年5月至2010年9月,马登先生担任硅技术公司副总裁。在加入该公司之前,马登曾在AMD担任高级研究员,负责推动AMD的下一代芯片集成方法。马登先生还是爱尔兰工程师学会的研究员和爱尔兰科学基金会的董事会成员。
William Madden joined the Company in May 2008 and currently serves as Executive Vice President and General Manager, Wired and Wireless Group, a position he has held since April 2019. From June 2018 to March 2019 he served as Executive Vice President, Hardware and Systems Product Development. From July 2017 to May 2018 he served as Senior Vice President, Hardware and Systems Product Development. From October 2010 to June 2017,Mr. Madden served as Corporate Vice President, FPGA Development and Silicon Technology. From May 2008 to September 2010,Mr. Madden served as Vice President of Silicon Technology. Prior to joining the Company, Mr. Madden served as a Senior Fellow at AMD where he drove AMD's next generation chip integration methodology. Mr. Madden is also a Fellow of the Institute of Engineers Ireland and a Board Member of Science Foundation Ireland.
Catia Hagopian

Catia Hagopian于2007年2月加入公司,目前担任高级副总裁、总顾问和秘书,自2018年3月起担任该职位。Hagopian女士负责公司在全球范围内的法律业务,包括商业交易、公司活动和政策、公司治理、雇佣、出口合规、知识产权和诉讼。2012年4月至2018年3月,Hagopian女士担任公司副总裁,负责法律事务、全球薪酬和福利。2007年2月至2012年4月,Hagopian女士在公司法律部担任多个高级职位。在加入本公司之前,Hagopian女士曾担任加利福尼亚州东区美国地区法院的法律事务员,并在多家律师事务所工作,包括DLA Piper LLP US。


Catia Hagopian joined the Company in February 2007 and currently serves as Senior Vice President, General Counsel and Secretary, a position she has held since March 2018. Ms. Hagopian is responsible for the Company's legal operations globally covering matters such as commercial transactions, corporate activities and policies, corporate governance, employment, export compliance, intellectual property and litigation. From April 2012 to March 2018,Ms. Hagopian served as the Company's Vice President, Legal Affairs, Global Compensation and Benefits. From February 2007 to April 2012,Ms. Hagopian held various senior positions in the Company's Legal Department. Prior to joining the Company, Ms. Hagopian served as a law clerk for the U.S. District Court, Eastern District of California and worked at several law firms, including DLA Piper LLP US.
Catia Hagopian于2007年2月加入公司,目前担任高级副总裁、总顾问和秘书,自2018年3月起担任该职位。Hagopian女士负责公司在全球范围内的法律业务,包括商业交易、公司活动和政策、公司治理、雇佣、出口合规、知识产权和诉讼。2012年4月至2018年3月,Hagopian女士担任公司副总裁,负责法律事务、全球薪酬和福利。2007年2月至2012年4月,Hagopian女士在公司法律部担任多个高级职位。在加入本公司之前,Hagopian女士曾担任加利福尼亚州东区美国地区法院的法律事务员,并在多家律师事务所工作,包括DLA Piper LLP US。
Catia Hagopian joined the Company in February 2007 and currently serves as Senior Vice President, General Counsel and Secretary, a position she has held since March 2018. Ms. Hagopian is responsible for the Company's legal operations globally covering matters such as commercial transactions, corporate activities and policies, corporate governance, employment, export compliance, intellectual property and litigation. From April 2012 to March 2018,Ms. Hagopian served as the Company's Vice President, Legal Affairs, Global Compensation and Benefits. From February 2007 to April 2012,Ms. Hagopian held various senior positions in the Company's Legal Department. Prior to joining the Company, Ms. Hagopian served as a law clerk for the U.S. District Court, Eastern District of California and worked at several law firms, including DLA Piper LLP US.
Salil Raje

Salil Raje于2004年6月加入公司,目前担任数据中心集团执行副总裁兼总经理,自2019年4月起担任该职位。2018年6月至2019年3月,他担任软件和IP产品执行副总裁。2017年4月至2018年5月,他担任软件和IP产品高级副总裁。2012年6月至2017年4月,Raje先生担任软件和IP产品集团公司副总裁。他还曾于2009年1月至2012年6月担任FPGA软件副总裁,并于2004年6月至2009年1月担任软件开发总监。在加入公司之前,Raje先生曾担任Hier Design,Inc.的首席技术官和首席执行官。Hier Design,Inc.是他于2001年共同创立的一家公司,直到2004年6月被该公司收购。


Salil Raje joined the Company in June 2004 and currently serves as Executive Vice President and General Manager, Data Center Group, a position he has held since April 2019. From June 2018 to March 2019 he served as Executive Vice President, Software and IP Products. From April 2017 to May 2018 he served as Senior Vice President, Software and IP Products. From June 2012 to April 2017 Mr. Raje served as Corporate Vice President, Software and IP Products Group. He has also served as Vice President, FPGA Software from January 2009 to June 2012 and as Director, Software Development from June 2004 to January 2009. Prior to joining the Company, Mr. Raje served as Chief Technology Officer and Chief Executive Officer of Hier Design, Inc., a company he co-founded in 2001 until it was acquired by the Company in June 2004.
Salil Raje于2004年6月加入公司,目前担任数据中心集团执行副总裁兼总经理,自2019年4月起担任该职位。2018年6月至2019年3月,他担任软件和IP产品执行副总裁。2017年4月至2018年5月,他担任软件和IP产品高级副总裁。2012年6月至2017年4月,Raje先生担任软件和IP产品集团公司副总裁。他还曾于2009年1月至2012年6月担任FPGA软件副总裁,并于2004年6月至2009年1月担任软件开发总监。在加入公司之前,Raje先生曾担任Hier Design,Inc.的首席技术官和首席执行官。Hier Design,Inc.是他于2001年共同创立的一家公司,直到2004年6月被该公司收购。
Salil Raje joined the Company in June 2004 and currently serves as Executive Vice President and General Manager, Data Center Group, a position he has held since April 2019. From June 2018 to March 2019 he served as Executive Vice President, Software and IP Products. From April 2017 to May 2018 he served as Senior Vice President, Software and IP Products. From June 2012 to April 2017 Mr. Raje served as Corporate Vice President, Software and IP Products Group. He has also served as Vice President, FPGA Software from January 2009 to June 2012 and as Director, Software Development from June 2004 to January 2009. Prior to joining the Company, Mr. Raje served as Chief Technology Officer and Chief Executive Officer of Hier Design, Inc., a company he co-founded in 2001 until it was acquired by the Company in June 2004.
Mark David Wadlington

Mark David Wadlington于2018年3月加入公司,目前担任核心市场集团高级副总裁。2018年3月至2020年2月,他担任全球销售部高级副总裁。在加入本公司之前,Wadlington先生曾于2017年4月至2018年3月在Synaptics Incorporated担任全球销售高级副总裁。在加入Synaptics之前,2013年2月至2017年3月,Wadlington先生在莱迪思半导体公司担任行政职务,包括担任莱迪思半导体公司移动和消费部门的公司副总裁兼总经理,以及全球销售的公司副总裁。加入莱迪思之前,Wadlington先生在2011年3月至2012年11月期间担任应用微电路公司AMCC全球销售副总裁。在加入AMCC之前,Wadlington先生曾担任公司美国销售副总裁、NVIDIA全球MCP(媒体通信处理器)销售副总裁,并在LSI Logic任职21年期间担任多个高级职位,包括担任LSI Logic全球半导体销售副总裁。


Mark David Wadlington joined the Company in March 2018 and currently serves as Senior Vice President, Core Markets Group. From March 2018 to February 2020 he served as Senior Vice President, Global Sales. Prior to joining the Company, Mr. Wadlington was Senior Vice President, Worldwide Sales at Synaptics Incorporated from April 2017 to March 2018. Prior to joining Synaptics, from February 2013 to March 2017,Mr. Wadlington held executive positions at Lattice Semiconductor, including serving as Corporate Vice President and General Manager, Mobile and Consumer Division at Lattice Semiconductor and Corporate Vice President of Worldwide Sales. Prior to Lattice, Mr. Wadlington was Vice President of Worldwide Sales at Applied Micro Circuits Corporation AMCC from March 2011 to November 2012. Prior to AMCC, Mr. Wadlington served as the Vice President of America's Sales at the Company, Vice President of Worldwide MCP (media communications processor) Sales at NVIDIA and held various senior-level positions at LSI Logic during his 21-year tenure there, including serving as LSI Logic's Vice President of Worldwide Semiconductor Sales.
Mark David Wadlington于2018年3月加入公司,目前担任核心市场集团高级副总裁。2018年3月至2020年2月,他担任全球销售部高级副总裁。在加入本公司之前,Wadlington先生曾于2017年4月至2018年3月在Synaptics Incorporated担任全球销售高级副总裁。在加入Synaptics之前,2013年2月至2017年3月,Wadlington先生在莱迪思半导体公司担任行政职务,包括担任莱迪思半导体公司移动和消费部门的公司副总裁兼总经理,以及全球销售的公司副总裁。加入莱迪思之前,Wadlington先生在2011年3月至2012年11月期间担任应用微电路公司AMCC全球销售副总裁。在加入AMCC之前,Wadlington先生曾担任公司美国销售副总裁、NVIDIA全球MCP(媒体通信处理器)销售副总裁,并在LSI Logic任职21年期间担任多个高级职位,包括担任LSI Logic全球半导体销售副总裁。
Mark David Wadlington joined the Company in March 2018 and currently serves as Senior Vice President, Core Markets Group. From March 2018 to February 2020 he served as Senior Vice President, Global Sales. Prior to joining the Company, Mr. Wadlington was Senior Vice President, Worldwide Sales at Synaptics Incorporated from April 2017 to March 2018. Prior to joining Synaptics, from February 2013 to March 2017,Mr. Wadlington held executive positions at Lattice Semiconductor, including serving as Corporate Vice President and General Manager, Mobile and Consumer Division at Lattice Semiconductor and Corporate Vice President of Worldwide Sales. Prior to Lattice, Mr. Wadlington was Vice President of Worldwide Sales at Applied Micro Circuits Corporation AMCC from March 2011 to November 2012. Prior to AMCC, Mr. Wadlington served as the Vice President of America's Sales at the Company, Vice President of Worldwide MCP (media communications processor) Sales at NVIDIA and held various senior-level positions at LSI Logic during his 21-year tenure there, including serving as LSI Logic's Vice President of Worldwide Semiconductor Sales.
Brice Hill

Brice Hill于2020年4月加入公司,目前担任执行副总裁兼首席财务官。2015年4月至2020年4月,他在英特尔公司(Intel)担任公司副总裁兼首席财务官兼技术、系统和核心工程部首席运营官。在此之前,希尔曾在英特尔担任过一系列其他职务,包括2013年至2015年担任公司战略和业务集团财务副总裁、2010年至2013年担任销售和营销总监、2005年至2010年担任公司财务总监。


Brice Hill joined the Company in April 2020 and currently serves as Executive Vice President and Chief Financial Officer. From April 2016 to April 2020 he served as Corporate Vice President and Chief Financial Officer and Chief Operating Officer, Technology, Systems and Core Engineering Group at Intel Corporation Intel. Prior to that, Mr. Hill held a series of other positions with Intel, including Vice President, Corporate Strategy and Business Group Finance from 2013 to 2015 Vice President, Sales and Marketing Controller from 2010 to 2013 and Corporate Finance Controller from 2005 to 2010.
Brice Hill于2020年4月加入公司,目前担任执行副总裁兼首席财务官。2015年4月至2020年4月,他在英特尔公司(Intel)担任公司副总裁兼首席财务官兼技术、系统和核心工程部首席运营官。在此之前,希尔曾在英特尔担任过一系列其他职务,包括2013年至2015年担任公司战略和业务集团财务副总裁、2010年至2013年担任销售和营销总监、2005年至2010年担任公司财务总监。
Brice Hill joined the Company in April 2020 and currently serves as Executive Vice President and Chief Financial Officer. From April 2016 to April 2020 he served as Corporate Vice President and Chief Financial Officer and Chief Operating Officer, Technology, Systems and Core Engineering Group at Intel Corporation Intel. Prior to that, Mr. Hill held a series of other positions with Intel, including Vice President, Corporate Strategy and Business Group Finance from 2013 to 2015 Vice President, Sales and Marketing Controller from 2010 to 2013 and Corporate Finance Controller from 2005 to 2010.
Vamsi Boppana

Vamsi Boppana于2008年10月加入公司,目前担任中央产品集团高级副总裁,自2020年2月起担任该职位。从2019年2月至2020年2月,他担任中央工程部高级副总裁。2017年1月至2019年1月,他担任公司副总裁,负责硅和系统开发。2013年7月至2016年12月,Boppana先生担任处理和开发副总裁。从2008年10月至2013年6月,他担任了多个工程职位的高级主管。在加入公司之前,Boppana先生管理着无晶圆厂晶片制造商Open Silicon,Inc.的技术开发工作,并担任他共同创立的Zenasis Technologies公司的工程副总裁。


Vamsi Boppana joined the Company in October 2008 and currently serves as Senior Vice President, Central Products Group, a position he has held since February 2020. From February 2019 to February 2020 he served as Senior Vice President, Central Engineering. From January 2017 to January 2019 he served as Corporate Vice President, Silicon and Systems Development. From July 2013 to December 2016 Mr. Boppana served as Vice President, Processor and Development. From October 2008 to June 2013 he served as Senior Director in various engineering positions. Prior to joining the Company, Mr. Boppana managed technology development at Open-Silicon, Inc., a fabless chip maker, and served as Vice President, Engineering at Zenasis Technologies, a company which he co-founded.
Vamsi Boppana于2008年10月加入公司,目前担任中央产品集团高级副总裁,自2020年2月起担任该职位。从2019年2月至2020年2月,他担任中央工程部高级副总裁。2017年1月至2019年1月,他担任公司副总裁,负责硅和系统开发。2013年7月至2016年12月,Boppana先生担任处理和开发副总裁。从2008年10月至2013年6月,他担任了多个工程职位的高级主管。在加入公司之前,Boppana先生管理着无晶圆厂晶片制造商Open Silicon,Inc.的技术开发工作,并担任他共同创立的Zenasis Technologies公司的工程副总裁。
Vamsi Boppana joined the Company in October 2008 and currently serves as Senior Vice President, Central Products Group, a position he has held since February 2020. From February 2019 to February 2020 he served as Senior Vice President, Central Engineering. From January 2017 to January 2019 he served as Corporate Vice President, Silicon and Systems Development. From July 2013 to December 2016 Mr. Boppana served as Vice President, Processor and Development. From October 2008 to June 2013 he served as Senior Director in various engineering positions. Prior to joining the Company, Mr. Boppana managed technology development at Open-Silicon, Inc., a fabless chip maker, and served as Vice President, Engineering at Zenasis Technologies, a company which he co-founded.
Brice Hill

Brice Hill自2022年3月起担任高级副总裁兼首席财务官。在加入应用公司之前,Hill先生于2020年4月在Xilinx公司担任执行副总裁兼首席财务官,Xilinx公司是一家设计和开发可编程设备及相关技术的公司,直至2022年2月被超微半导体公司收购。在加入赛灵思之前,Hill曾在英特尔公司担任多个财务职务25年,最近担任过公司副总裁兼首席财务官以及技术、系统和核心工程集团首席运营官。


Brice Hill has been Senior Vice President and Chief Financial Officer since March 2022. He also oversees Global Information Services for Applied. Prior to joining Applied, Mr. Hill was Executive Vice President and Chief Financial Officer of Xilinx, Inc., a company that designed and developed programmable devices and associated technologies, from April 2020 until its acquisition by Advanced Micro Devices, Inc. in February 2022. Prior to Xilinx, Mr. Hill served in vario finance positions with Intel Corporation for 25 years, most recently as Corporate Vice President and Chief Financial Officer and Chief Operating Officer, Technology, Systems and Core Engineering Group.
Brice Hill自2022年3月起担任高级副总裁兼首席财务官。在加入应用公司之前,Hill先生于2020年4月在Xilinx公司担任执行副总裁兼首席财务官,Xilinx公司是一家设计和开发可编程设备及相关技术的公司,直至2022年2月被超微半导体公司收购。在加入赛灵思之前,Hill曾在英特尔公司担任多个财务职务25年,最近担任过公司副总裁兼首席财务官以及技术、系统和核心工程集团首席运营官。
Brice Hill has been Senior Vice President and Chief Financial Officer since March 2022. He also oversees Global Information Services for Applied. Prior to joining Applied, Mr. Hill was Executive Vice President and Chief Financial Officer of Xilinx, Inc., a company that designed and developed programmable devices and associated technologies, from April 2020 until its acquisition by Advanced Micro Devices, Inc. in February 2022. Prior to Xilinx, Mr. Hill served in vario finance positions with Intel Corporation for 25 years, most recently as Corporate Vice President and Chief Financial Officer and Chief Operating Officer, Technology, Systems and Core Engineering Group.
Vincent L. Tong

Vincent L. Tong , 1990年5月加入公司并担任多个重要职位,包括产品科技副总裁、全球质量和可靠性副总裁。2008年4月他停止担任全球质量和新产品推广 高级副总裁职位并在2011年10月停止亚太地区执行负责人的工作。加入公司之前,他在单片存储器(逻辑器件的生产商)和AMD担任多个工程职位;现任全球半导体联盟(非盈利半导体组织)董事。


Vincent L. Tong joined the Company in May 1990 and currently serves as Executive Vice President, Global Operations & Quality, a position he has held since May 2016. From January 2015 to May 2016 Mr. Tong served as Senior Vice President, Global Operations and Quality. He also has served as Executive Leader, Asia Pacific since October 2011. Mr. Tong previously served as Senior Vice President, Worldwide Quality and New Product Introductions from June 2008 to January 2015. He has also served as Vice President, Worldwide Quality and Reliability from August 2006 to June 2008 and prior to that as Vice President of Product Technology from May 2001 to July 2006. Prior to joining the Company, Mr. Tong served in a variety of engineering and management positions at Monolithic Memories, a producer of logic devices, and AMD. He holds seven U.S. patents.
Vincent L. Tong , 1990年5月加入公司并担任多个重要职位,包括产品科技副总裁、全球质量和可靠性副总裁。2008年4月他停止担任全球质量和新产品推广 高级副总裁职位并在2011年10月停止亚太地区执行负责人的工作。加入公司之前,他在单片存储器(逻辑器件的生产商)和AMD担任多个工程职位;现任全球半导体联盟(非盈利半导体组织)董事。
Vincent L. Tong joined the Company in May 1990 and currently serves as Executive Vice President, Global Operations & Quality, a position he has held since May 2016. From January 2015 to May 2016 Mr. Tong served as Senior Vice President, Global Operations and Quality. He also has served as Executive Leader, Asia Pacific since October 2011. Mr. Tong previously served as Senior Vice President, Worldwide Quality and New Product Introductions from June 2008 to January 2015. He has also served as Vice President, Worldwide Quality and Reliability from August 2006 to June 2008 and prior to that as Vice President of Product Technology from May 2001 to July 2006. Prior to joining the Company, Mr. Tong served in a variety of engineering and management positions at Monolithic Memories, a producer of logic devices, and AMD. He holds seven U.S. patents.