主营介绍

  • 主营业务:

    从事MEMS和功率器件等领域的晶圆代工及模组封测业务。

  • 产品类型:

    晶圆代工、模组封测、研发服务

  • 产品名称:

    MEMS 、 功率器件 、 车载塑封功率模组 、 灌封功率模组 、 智能功率模组 、 低热阻铜扣封装 、 研发服务

  • 经营范围:

    半导体(硅及各类化合物半导体)集成电路芯片制造、针测及测试、测试封装;先进晶圆级封装;电子元器件及光学元器件研发及制造;光刻掩模版开发制造;模具制造与加工;与集成电路、电子/光学元器件有关的开发、设计服务、技术服务;销售自产产品,并提供相关技术咨询和技术服务;从事货物及技术的进出口业务;自有设备、房屋租赁。(依法须经批准的项目,经相关部门批准后方可开展经营活动)

主营构成分析

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营业收入 X

单位(%) 单位(万元)
注:通常在中报、年报时披露 
业务名称 营业收入(元) 收入比例 营业成本(元) 成本比例 利润比例 毛利率
按产品 晶圆代工 35.57亿 77.22% 35.60亿 77.11% 29.02% -0.09%
其他业务 6.48亿 14.07% 6.23亿 13.50% -228.16% 3.79%
封装测试 2.93亿 6.36% 3.25亿 7.04% 299.14% -10.98%
研发服务 1.08亿 2.35% 1.08亿 2.35% - 0.00%
按地区 内销 35.65亿 77.40% 36.20亿 78.40% 508.62% -1.53%
其他业务 6.48亿 14.07% 6.23亿 13.50% -228.16% 3.79%
外销 3.93亿 8.54% 3.74亿 8.10% -180.46% 4.94%

董事会经营评述

  1、营业收入分析
  公司是国内领先的特色工艺晶圆代工企业,主要从事MEMS和功率器件等领域的晶圆代工及封装测试业务,为客户提供一站式服务的代工制造方案。报告期各期,公司主营业务收入占当期营业收入的比例分别为98.20%、99.03%及85.93%,主营业务突出。2020年度及2021年度,公司其他业务收入分别为1,331.76万元、1,970.18万元,占营业收入的比例较小,分别为1.80%及0.97%,主要为销售光罩。2022年度,公司其他业务收入为64,790.95万元,占营业收入的比例为14.07%,主要为公司向员工销售配套用房。
  报告期各期,公司营业收入分别为73,915.5... 查看全部▼

  1、营业收入分析
  公司是国内领先的特色工艺晶圆代工企业,主要从事MEMS和功率器件等领域的晶圆代工及封装测试业务,为客户提供一站式服务的代工制造方案。报告期各期,公司主营业务收入占当期营业收入的比例分别为98.20%、99.03%及85.93%,主营业务突出。2020年度及2021年度,公司其他业务收入分别为1,331.76万元、1,970.18万元,占营业收入的比例较小,分别为1.80%及0.97%,主要为销售光罩。2022年度,公司其他业务收入为64,790.95万元,占营业收入的比例为14.07%,主要为公司向员工销售配套用房。
  报告期各期,公司营业收入分别为73,915.55万元、202,393.65万元及460,633.77万元,呈现快速增长趋势,主要受益于行业规模不断扩大、自身产能逐渐释放、高质量的晶圆代工业务产品和一站式服务不断获得客户认可、完善的技术研发体系及稳定的核心管理团队,具体情况如下:
  (1)行业市场规模不断扩大
  公司晶圆代工业务涵盖MEMS、功率器件(IGBT、MOSFET)产品。近年来消费电子、汽车电子、工业控制等领域发展,带动MEMS和功率器件市场规模不断增长,进而推动了晶圆代工行业规模持续扩大。
  根据Yole统计,2020年全球MEMS行业市场规模为120亿美元,预计2026年市场规模将达到183亿美元,2020-2026年均复合增长率为7.3%;2020年全球IGBT市场规模为54亿美元,预计2026年市场规模将达到84亿美元,2020-2026年均复合增长率为7.6%;2020年全球MOSFET市场规模为76亿美元,预计2026年市场规模将达到95亿美元,2020-2026年均复合增长率为3.8%,MEMS、IGBT、MOSFET市场规模均呈稳步增长趋势。伴随国内MEMS及功率器件行业进口替代的发展趋势,未来国内MEMS和功率器件行业规模将继续保持增长。
  (2)公司产能快速提高
  报告期内,公司产能快速提升是推动业务规模增长的关键因素。在行业需求增长的有利推动下,公司持续加大生产线工程、设备投入,以满足产能快速提高的需求。报告期各期,公司产能分别为39.29万片、89.80万片及139.00万片,产能的快速增长为公司出货量增长提供了可靠保障,推动了公司业务规模的持续扩大。
  (3)公司高质量的晶圆代工业务和一站式服务不断获得客户认可
  公司凭借完整的技术布局、完善的研发体系、规模化的生产能力、完善的质量管理体系,持续为客户提供高质量的晶圆代工业务。同时,公司可以提供晶圆代工到封装测试的一站式代工服务以满足客户全方位的需求。
  公司不断积极开发新的客户资源,客户群体涵盖国内外一流的半导体公司,公司先进的晶圆代工工艺技术获得了市场高度认可和良好的业界口碑,积累了广泛的客户基础,促进了公司收入规模增长。
  (4)完善的技术研发体系保障
  公司秉承市场为导向的研发创新机制,组建了专业化的核心研发团队,建立了完善的技术研发体系,不断根据市场需求实现工艺技术迭代。公司完善的技术研发体系为公司生产工艺的升级、应用领域的拓宽提供了技术保障,推动收入持续增长。
  (5)稳定的核心管理团队
  公司核心管理团队稳定,具备丰富的半导体行业经营管理经验。基于公司业务特点、客户需求及行业发展趋势,公司核心管理团队制定了符合公司实际情况的发展战略和业务模式,保证了公司的持续经营能力,为公司业务持续增长提供了有力保障。
  2、主营业务收入分析
  (1)产品构成分析
  报告期各期,公司主营业务收入分别为72,583.80万元、200,423.47万元及395,842.83万元。公司主营业务收入包括晶圆代工收入、封装测试收入和研发服务收入,其中晶圆代工业务涵盖MEMS、功率器件两类产品。公司主要收入来源于晶圆代工业务,晶圆代工收入占主营业务收入比例分别为86.07%、92.09%及89.86%。
  报告期各期,公司封装测试收入占主营业务收入比例分别为2.59%、5.19%及7.40%;公司研发服务业务主要为客户新合作产品和工艺平台提供研究和开发服务,研发服务收入占主营业务收入比例分别为11.34%、2.72%及2.74%。
  (2)销售区域分析
  公司在行业内建立了良好的口碑,积累了丰富的客户资源,销售区域覆盖中国、日本、美国以及欧洲等国家或地区。
  报告期各期,公司内销收入分别为59,618.85万元、187,795.00万元及356,515.72万元,占主营业务收入的比分别为82.14%、93.70%及90.06%。中国目前是全球最大的MEMS和功率器件消费国家,市场需求持续增加。公司深耕中国市场,依托区位优势,收入规模持续扩大。
  (3)产品数量和价格分析
  随着公司产能逐年增加,晶圆销量稳步攀升,报告期各期,公司晶圆销量分别为309,804片、772,943片及1,285,174片,销售均价分别为2,016.60元/片、2,387.95元/片及2,767.82元/片。
  报告期内,公司晶圆销售均价逐步提高,主要原因为:
  ①公司持续对MEMS和功率器件的各个下游应用领域进行市场开拓和工艺研发,产品结构不断优化,高附加值产品占比逐步提高;
  ②2020年至2021年,半导体行业需求旺盛、产能紧张,公司根据市场情况上调了部分产品的价格。
  ③2022年,公司自研的价格相对较高的技术平台不断获得客户认可,收入占比提高,且功率器件价格在2021年调高后处于相对高位,功率器件平均价格有所上升,带动公司晶圆代工业务价格有所上升;MEMS主要应用于消费领域,受消费电子行业市场景气度下降影响,部分消费类产品销量及销售单价出现下滑,使得MEMS平均价格有所下降,一定程度减缓了晶圆代工业务价格上升。
  (4)应用领域分析
  公司已形成了完善的业务布局,除了在市场较大的消费电子领域不断提升收入规模外,还加强对重点应用领域的布局。公司利用自身技术优势,持续开发附加值较高的应用于汽车、工业领域的技术平台并加大应用推广。报告期内公司晶圆代工业务在汽车、工业应用领域的收入金额及占比不断提升,产品结构明显优化。2022年第四季度,公司晶圆代工业务中来自于汽车领域的收入占比已接近40%。
  (5)季节性分析
  报告期内,公司产能和销售规模快速增长,使得年度内各季度收入占比呈现增长趋势。除此之外,公司不存在明显的收入季节性特征。
  (6)第三方回款
  2020年度,公司存在第三方回款的情形,金额为3,021.43万元,占当年营业收入的比例为4.09%,主要系客户为其全资子公司代付货款以及客户向其他方转让订单所致,不存在虚构交易或调节账龄的情形,亦不存在因第三方回款导致的货款归属纠纷。 收起▲